Electronics Forum: viewing (Page 1395 of 7892)

testing after SMt assembly

Electronics Forum | Tue Jul 20 02:19:59 EDT 1999 | Hunter

Dear all Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. Our appliocation is Mainly fabrication of mother boards. Thanks

Titanium finger

Electronics Forum | Fri Jul 16 22:22:12 EDT 1999 | Barden

My wavesoldering machine is equipped with Titanium finger. What composition of Titanium alloy used ? Any grade difference, and which is the best grade for long life ? An info or website concerning it.

BGAs and vapor phase

Electronics Forum | Fri Jul 16 15:30:22 EDT 1999 | SMTASSY

Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still thi

Site Home Page Errors

Electronics Forum | Fri Jul 16 08:25:20 EDT 1999 | Clifford Peaslee

Hello Everyone, We have encountered problems with the base cold fusion language on the server, and we are still trying to resolve it. The site may be down periodically today while we isolate and fix the problem. Thanks for your patience, Cliff

Stripping Magnet Wire

Electronics Forum | Thu Jul 15 19:22:26 EDT 1999 | Jeff Sanchez

I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys.

VOC free Flux in Inert Wave Solder Machine

Electronics Forum | Thu Jul 15 18:50:43 EDT 1999 | Raeto Zryd

We intend to use VOC free fluxe in our nytro machine. Does anybody know if there can be problems with water ie. solvent residues in the tunnel. Perhaps there are some white papers available on that issue.

Soldering on gold

Electronics Forum | Thu Jul 15 16:29:49 EDT 1999 | Charles Morris

We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow profi

Re: BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 19:14:08 EDT 1999 | Gord Wait

Thanks for all the feedback. I'm going for the tsop's on back, with approval from manufacturing, of course. This forum is just what the doctor ordered!

so slow...

Electronics Forum | Wed Jul 14 10:46:58 EDT 1999 | John Thorup

it's just so slow. yesterday afternoon and this morning i have had to leave the site because the delays, timeouts and other errors. what's up?

GSM Bump Process

Electronics Forum | Wed Jul 14 05:54:57 EDT 1999 | Larry Jeter

I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful


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