Electronics Forum | Tue Oct 17 01:42:34 EDT 2000 | Peter Carry
Dave, That's the funny thing, thru all that the output was pretty consistant with at least one bridge per board. * The ICs are going thru the wave in-line, according to IPC-782 figure 3-9, "Preferred IC Orientation". * Flatness of second wave is cont
Electronics Forum | Thu Oct 19 00:54:26 EDT 2000 | PeteC
Top side temp. is 97C before the wave. No, we don't have the IR lamp on; we did try it though with no positive change. Solder alloy Multicore 63/37 Other boards run better. This one is the worse. We have not had good success eliminating bridges on SM
Electronics Forum | Mon Oct 16 00:45:33 EDT 2000 | soza
Dear sir, I have a problem to find the new chemical solution instead IPA(isopropyl alcohol) to eliminate contamination on the test pin socket board made from copper that plate with nickle and gold. And after the often testing IC process, the co
Electronics Forum | Mon Oct 16 20:45:45 EDT 2000 | Dave F
Thanks Nance. So, your production process is: * Screen / dispense glue on secondary side * Place secondary side SMT components * Cure glue * Insert primary side PTH components * Wave secondary side Please tell us about: * Flux type and wave s
Electronics Forum | Tue Aug 22 14:52:55 EDT 2000 | John Thorup
Jax - absolutely right - the archives are a valuable tool and deserve to be used more than they seem to be. Caumel - Are your blobs on the solder side or the component side? Are your vias tented on the component side? What size are your vias? Is th
Electronics Forum | Mon Aug 21 20:20:18 EDT 2000 | Dave F
Hi CJ: I guarantee you that the portions of you BGA that will physically move the most as a result of changing temperature are the corners. For this very reason, many BGA have BT substrates that have a tg of 210�C. I would demonstrate the potentia
Electronics Forum | Thu Aug 10 13:30:54 EDT 2000 | Bob Willis
Solder skips on SOT23 parts is the most common issue when soldering surface mount designs. The two most common causes are the wave height too low or there is too much gassing of the flux as it contacts and seperates the wave. Stck some parts on your
Electronics Forum | Fri Aug 04 11:04:27 EDT 2000 | John
We manufacture a mixed technology board, that uses a through hole "mini cap" with a 2.5 mm lead span. We have had several failures caused by solder wicking up through the plated through hole pcb and touching the can. This shorts out the capacitor.
Electronics Forum | Thu Jul 20 10:03:30 EDT 2000 | Bob Willis
All the points raised so far are correct. Only use QFPs if rearly pushed as the yield on your process will suffer. I have wave soldered parts down to 0.020" in nitrogen with OK results but the pads and drainage pads need to be worked on. Another r
Electronics Forum | Thu Jun 29 10:38:04 EDT 2000 | John Thorup
Hello Christopher I don't know if there is any kind of official standard but I can tell you that the HADCO DFM manual specifies a nominal thickness of 50-1500u" with an option for 100-1000u" and the Merix DFM manual specifies 30-200u" Our boards (fro
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