Electronics Forum | Tue May 22 14:35:27 EDT 2018 | designchain
Most are reaching out to suppliers and asking whether the parts/materials they are buying contain any of the Prop65 substances. Others already have that info because they've been collecting it all along. The challenge, after getting the data, is det
Electronics Forum | Mon Aug 06 14:37:32 EDT 2018 | dleeper
What about some kind of surface mount clip? Solder the clips to the PCB and then insert the coil manually? IT adds a little labor but at least your coil won't move. For reference here's a company that makes that sort of thing. There are plenty of ot
Electronics Forum | Wed Feb 13 20:27:02 EST 2019 | SMTA-Chris
We’ve done similar projects. FR-811 with camera system for alignment. More cost effective than split vision. Bottom heat uses solid surface for contact heating similar to heating microwave module chassis. Our rep can arrange a demo if you haven’t
Electronics Forum | Fri Mar 29 08:27:46 EDT 2019 | SMTA-williams
Can anyone help understanding the function of the oil in a bi-components Thermal Interface Material ? After a while, when the material is stored, the oil comes up in the surface : shall we remove it ? shall we re-integrate it into the TIM ? what if w
Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs
We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee
Electronics Forum | Fri Jan 10 03:40:41 EST 2020 | jakapratama
Hi, Some nano coat supplier said that you can drop water to the surface where the coating supposed to present before to check. If it's beading, it's still there. I take it that you meant by self in-house wiping of coating, yes? Stencil supplier nan
Electronics Forum | Thu Feb 13 03:54:57 EST 2020 | majdi4
we are obliged by customer specifications that there will be no glue despensing process on the production line.. also that the glue dispensing process is very complicated for this case .. we could have glue splash on top surface of pcb so that will
Electronics Forum | Fri Feb 28 08:48:00 EST 2020 | SMTA-Joe
We've made the decision to move towards Gold Immersion on our PCBs to eliminate flatness issues with QFNs and BGAs. Land/component pad geometry, population density, and other factors, have made it necessary to ensure a near perfectly flat surface tha
Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran
I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.
Electronics Forum | Fri Jan 22 13:22:18 EST 2021 | davidhillman
Hi Graham - brite acid tin gets it "shiny" appearance due to codeposited organic material in the tin plating. The codeposited materials volatilize during the soldering process causing a ton of voids. Brite acid tin plating should not be used as a sol
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