Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan
Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ
Electronics Forum | Wed Aug 26 20:52:15 EDT 2020 | stephendo
One thing about liquid N2 is while it is safe, only let trained personnel near it. I believe if someone got their hand frozen on the side, it is not coming off until the dewer is completely empty and warmed up. And make sure management understands
Electronics Forum | Tue Oct 20 05:47:42 EDT 2020 | Mike Konrad
Most often, dull solder joints (post cleaning) is a result of the cleaning chemical. Most (not all) modern cleaning chemicals are equipped with corrosion inhibition agents which prevent dulling. Check with your chemical supplier to see if your specif
Electronics Forum | Thu Apr 14 13:49:34 EDT 2022 | winston_one
Thank you for reply, Stephen. No, As I wrote it was leaded process. I heard that it is possible with lead free solder at higher temps an dwell time. At NPL Defect Database I've find this case wich looks exactly the same: http://defectsdatabase.npl.co
Electronics Forum | Wed Oct 19 07:04:06 EDT 2022 | winston_one
If any changes in design is not possible and you have to solder it, it's a real headache, I know... I see only 3 options here that you can try consiquently: 1) Accurately profile the board and optimize a profile (go to lower limit of process windo
Electronics Forum | Wed May 03 13:34:04 EDT 2023 | proceng1
When we get a bad print at SMT, the operator uses the alcohol wipes and wipes the paste off the board. Then they use compressed air and another wipe. In most cases this is sufficient. Most vias are tented, but there still remains some solder sphere
Electronics Forum | Mon Aug 07 04:05:43 EDT 2023 | suradi
May I share regarding this issue. Initially, please define the root cause clearly, is it from materials or process. Refer to the picture, if the short location is not randomly meaning there is the process issue. It could be stencil design or paste pr
Electronics Forum | Wed Aug 09 15:06:17 EDT 2023 | SMTA-64386426
The first thing I do when looking at a part relative to stencil design, is determine the coplanarity per the data sheet. Ideally your stencil thickness should be equal to, or if needed, greater than the coplanarity. You want the solder paste to com
Electronics Forum | Sun Mar 05 13:02:00 EST 2000 | dave
We used this type of paste in a fine pitch application for over two years with no problems. You must be very careful of any (dust)or spillage while mixing for obvious reasons. In my opion the very thing that makes it interesting "freshness" is also i
