Electronics Forum | Wed Jul 02 19:20:43 EDT 2003 | teamcanada
Have you looked into Kapton tape as a protectant?
Electronics Forum | Thu Nov 25 08:12:22 EST 2004 | davef
Search the fine SMTnet Archives for contacts, while you await other responses.
Electronics Forum | Tue Jun 28 07:27:32 EDT 2005 | Matt Kehoe
We are experiencing a situation that we would really appreciate some expert opinions on. Our process prints solder paste then reflows it without components. Normally the paste wicks into a very shiny rounded meniscus. Even over gold, the round pads a
Electronics Forum | Tue Jun 28 18:20:49 EDT 2005 | russ
Matt, have you run a profile on this board? Just because it's .062" doesn't mean that any old .062" profile will work. We have .062" thick boards that almost nil for copper and other are utilizing 2 oz. layers internally. They require quite diffe
Electronics Forum | Tue Jun 28 19:58:59 EDT 2005 | davef
Michael: What's this "tint"? How do you do it? Tell us more, please.
Electronics Forum | Tue Jul 11 14:09:54 EDT 2006 | Chunks
Not reflowing completely. Slower = hotter. Try a slower conveyor speed.
Electronics Forum | Mon Dec 13 16:07:38 EST 1999 | Travson
Russ, Regarding your no clean soldering to gold. We have been doing that for about three years now. We have been using 62/36/2% silver solder paste. I have not done any thorough testing as to joint strength but the finish is shinier. It looks li
Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris
Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is
Electronics Forum | Sat Jan 23 12:37:35 EST 1999 | parag palshikar
hi, i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier process ut
Electronics Forum | Fri Feb 28 08:48:00 EST 2020 | SMTA-Joe
We've made the decision to move towards Gold Immersion on our PCBs to eliminate flatness issues with QFNs and BGAs. Land/component pad geometry, population density, and other factors, have made it necessary to ensure a near perfectly flat surface tha
