Electronics Forum | Wed Dec 19 20:42:55 EST 2007 | davef
gersla: You're correct that carriers of low temperature material will disfigure and become useless at 125*C bake temperatures. The reason you can not find 70*C bake data is: J-STD033B, "4.2.2 Low Temperature Carriers. SMD packages shipped in low tem
Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid
25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P
Electronics Forum | Fri Apr 10 07:52:16 EDT 2009 | davef
On cure checking, we have this undated note from Jack Crawford at IPC * IPC-SM-840C "Qualification and Performance of Permanent Solder Mask" has several Test Methods for different types of solder resist material, but probably the only applicable one
Electronics Forum | Sat Feb 12 13:19:27 EST 2011 | tpappano
A simple trick I read either here or on another P&P forum is to use "Silly Putty". Place a small thin spot of Silly Putty on the top of the front conveyor rail, and put the machine in "manual" mode. Steer head #1 over the putty and lower it, leavin
Electronics Forum | Tue Jul 24 09:20:44 EDT 2018 | fugtussey
Note that the TF2800 features a large 7 panel preheater with an adjustable height component that allows you to adjust the height of the IR preheater to get much closer to the board. This feature multiples the power of the preheater exponentially, so
Electronics Forum | Thu Jun 27 08:47:21 EDT 2019 | SMTA-John
Having success with Circuit Boards #432 Solvent Resistant Ink - Designed specifically for circuit boards. This medium dry ink is highly resistant to solvents .... It is also non-conducting. Note: this ink contains an aggressive solvent so should not
Electronics Forum | Sat Jan 06 11:39:56 EST 2001 | Steve Thomas
On a related note, I'm wondering if any of the newer devices have any way to factor in paste not releasing from the corners, or for that matter, radiused, oval, or round apertures. We have an LSMII, and all it does it let you draw a rectangle around
Electronics Forum | Thu Nov 09 01:17:28 EST 2000 | DL
John, Ahhhh the possibilities. Have you considered the dissipative properties of available substrates? A ceramic (excellent heat dissipation) based substrate could be a possibility for future designs. Maybe there are surface mount parts out there fo
Electronics Forum | Wed Jul 19 01:20:17 EDT 2000 | Craig
Does anyone have any experience wave soldering TQFPs. Our R&D is wanting us to do this but we (production) are hesitant. I've found some recommended pad designs and solder theiving designs in a Philips app note "SMD Mounting Methods". The theory look
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
