Electronics Forum: solderers (Page 1412 of 2099)

Re: Poor solderability

Electronics Forum | Fri Feb 11 05:44:08 EST 2000 | Dean

Sounds like black pad to me. I just suffered this last week. Track your fab lot codes. Just in case. I processed 1000 fabs of 2 lot codes through 1 line (also WS609). 1 lot code failed with black pad the other did not. With one common mfg. proc

Re: Poor solderability

Electronics Forum | Mon Feb 14 12:19:32 EST 2000 | Dave F

Dean: I associate black plague as an immersion gold process problem (although I could easily be wrong): Everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive. The immersion gold works by corroding the nic

Squeege Snap off (MEASURED?)

Electronics Forum | Mon Jan 15 15:00:11 EST 2001 | pr

It is the distance between board and stencil. When your stenciling solder paste you usually want to contact print (which is "0" snapoff). When you are stenciling adhesive you can affect your dot size and quality by using a gap between board and stenc

Re: Solder Paste Height

Electronics Forum | Sat Jan 06 10:37:43 EST 2001 | Dave F

We have talked about using mircoscopes and laser thingies for measuring paste height on SMTnet previously. [Fine SMTnet Archives might give background.] Some people use a 0603 chip cap as a standard. I'm not sure how stencil height relates. Paste

Re: Solder Paste Height

Electronics Forum | Sat Jan 06 11:39:56 EST 2001 | Steve Thomas

On a related note, I'm wondering if any of the newer devices have any way to factor in paste not releasing from the corners, or for that matter, radiused, oval, or round apertures. We have an LSMII, and all it does it let you draw a rectangle around

Reliability test on PCBA

Electronics Forum | Thu Dec 21 04:27:31 EST 2000 | teohbengee

Need help urgently. Anyone can provide me some information or site on reliability test on PCB assembly like solder joint or anything. Some test like ERSA Test, SHMOO Test, Pull Test, Temperature cycle and humidity Test, vibration Test or any related

Re: Solder Ball Voltage Capacity

Electronics Forum | Wed Dec 20 21:32:47 EST 2000 | Dave F

You're correct it's a goofy question. Voltage is going to be circuit dependent, since the ball will be connected to the board. There's some ball dimensions in the fine SMTnet Archives ... they're about four times the diameter of your wires. If tha

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Thu Dec 21 20:13:02 EST 2000 | Brad Kendall

I used to switch my N2 on and off for different products and I had performed profiles on the products with and without the N2 on and there was not a difference in the profiles. So you should not have to adjust your profiles. I think everyone else c

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:38:28 EST 2000 | Dave F

OK, now let me ask the really dopey question ... so if the irregularity of the HASL surface is punching holes in the thermal gasket and causing shorts to the heat sink, why are you putting solder on that surface? I wonder how the thermal conductivit

Re: Aqueous Technologies Cleaners

Electronics Forum | Thu Dec 07 11:38:04 EST 2000 | Dason C

Please advsie what kind of the solder paste which you are using and we have experience when using Alpha WS609 and found a lot of foaming. Beside, are you using the spray fluxer for your wave or not? If you have spray fluxer then you don't need to u


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