Electronics Forum: pass (Page 142 of 150)

Re: Flux splattering during reflow

Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory

| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef

1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use

Solder Paste Inspection System.

Electronics Forum | Mon Mar 11 13:11:00 EST 2002 | steve_arneson

I have read all of the previous threads and have found it very hard to believe what I am hearing. The idea that AOI is not needed on your production line is like running a marathon without training before hand. You can only expect to get out of an

DPAK land pattern

Electronics Forum | Thu Mar 21 21:21:37 EST 2002 | davef

In the beginning, there was TO-5. And it was good. Flushed with success, they created TO-220. It too was good. Then came SMT. It was better than some things, but then again ... In these early days, there was a haze on the horizon that blocked t

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op

Help SMTnet with new feature

Electronics Forum | Mon Apr 22 14:21:50 EDT 2002 | bdoyle

Hello Everyone! I'm sure everybody is curious about what we're up to every day. Well in an effort to improve the site for all of our users we're currently working on a pretty big feature. This feature comes as an answer to the countless emails we

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Sun May 09 16:25:00 EDT 2004 | gabriele

Military and most commercial standards requires > post-soldered boards to measure less than 10 > �g/in of NaCl (14 when using an Omegameter, 20 > on a Ionagraph, and 37 on a Zero-Ion). > > As Dave > stated, 6.5 �g/in of NaCl is called out in >

SMT EQUIPMENT FOR LOW VOLUME HIGH MIX

Electronics Forum | Tue Apr 29 14:13:52 EDT 2003 | stefwitt

My opinion to hold on to your machines was based on the current market situation. First of all, I don�t believe that a customer with ten boards will go to China for prototype production. Truth is, that the remaining market here is the prototyping mar

Lead Free Solder Wick

Electronics Forum | Fri Mar 10 00:17:47 EST 2006 | Samir

Patrick, My sardonic wit comes from 11 years of being an embattled process guy who�s basically �seen it all� in electronics manufacturing. I�ve been witness to the �Seagull Managers�, uneducated managers lacking credentials, managers with MBAs but

Soft Water Versus Deionized

Electronics Forum | Sat Jan 27 08:45:43 EST 2007 | davef

[clipped] Chemistry of Hard and Soft Water From Anne Marie Helmenstine, Ph.D., Your Guide to Chemistry. Water Works I'm sure you've heard the terms 'hard water' and 'soft water', but do you know what they mean? Is one type of water somehow better th


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