Electronics Forum | Tue Oct 01 08:12:54 EDT 2002 | madreindeer
Hi, Have anyone done STSOP32 circuit with 0,5mm pitch with wave? or anything simular. Thanks for advance, BR, Mr.T
Electronics Forum | Tue Oct 01 12:23:26 EDT 2002 | barryg
We are looking at possible doing a few through hole components on the smt line. Is this feasable? What types of components are diffucult to do this way? What stencil considerations are there? Anyone have any info on this subject?
Electronics Forum | Tue Oct 01 16:22:46 EDT 2002 | stepheno
You have to be sure the TH parts can take the reflow temps. A lot of time you willl have to get special components. We do some BNC's this way, but they had to be special order BNC's. There is more info in the fine SMTnet archives.
Electronics Forum | Tue Oct 01 18:32:55 EDT 2002 | davef
We don't like ministencils. Consider using the patterns listed in the Practical Components and Topline catalogs. Few BGA we see have a 3X3 courtyard.
Electronics Forum | Wed Oct 02 14:11:14 EDT 2002 | slthomas
Dave, you have a good memory as well as an unhuman mastery of the internet search engine! Thanks, dude, I'll take my hammer, if I can find it. Maybe bring back some garnets....
Electronics Forum | Wed Oct 02 21:01:20 EDT 2002 | davef
I'm looking for a turtle ~5" in diameter with no fussy lineage to use as a paper weight. Are you too far West?
Electronics Forum | Wed Oct 09 16:43:50 EDT 2002 | mjz289
Kester 256 has also worked tremendously well for us. We have soldered thousands of BGAs from 156 balls to 780 balls .8mm pitch with no solder problems (shorts,opens or voids) and no residue problems. Give it a try.
Electronics Forum | Wed Oct 02 00:08:26 EDT 2002 | praveen
Hi, We are using chip components with Silver Pladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how ti improve the solder wetting for those components. Thanks,
Electronics Forum | Wed Oct 02 00:08:39 EDT 2002 | praveen
Hi, We are using chip components with Silver Paladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how to improve the solder wetting for those components. Thanks,
Electronics Forum | Thu Oct 03 10:02:08 EDT 2002 | davef
Your problem is likely not the Pd-Ag surface layers, but the underlying metal to which you need to wet. Either a base metal is: * Contaminated and poorly wettable. OR * A material [eg, Alloy 42 (check with magnet), Kovar, etc] that is inherently dif
