Electronics Forum: printing (Page 143 of 482)

Stencil Opening

Electronics Forum | Sun Feb 22 05:53:25 EST 1998 | Ron Lahat

Stencil Opening Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable

solder paste in Flipchip

Electronics Forum | Tue Feb 17 01:12:52 EST 1998 | J.H. Kim

In solder bumping in flipchip technology by splder printing, the precise control of solder volume and height is very difficult. Therefore I'd like to know the solution of this problem. Thanks

Re: solder paste in Flipchip

Electronics Forum | Tue Feb 17 01:15:26 EST 1998 | J.H Kim

| In solder bumping in flipchip technology by solder printing, | the precise control of solder volume and height is very difficult. | Therefore I'd like to know the solution of this problem. | Thanks

Additive trace services

Electronics Forum | Tue Aug 14 15:44:04 EDT 2001 | davef

Check the fine SMTnet Archives for contacts at ASI and Conductive Circuits. They print materials on substrates to incorporate ECO, not sure about making the trace cuts, though.

Applying past with CamAlot

Electronics Forum | Thu Aug 23 21:04:03 EDT 2001 | davef

We don't use the machine you suggest, but dispensing paste in front of a placer is a very powerful set-up for some production environments. Check the fine SMTnet Archives for a comparison between dispensing and printing paste.

Board Stretch...Is there a relevant IPC spec?

Electronics Forum | Wed Aug 22 19:54:54 EDT 2001 | mkallen

Can anyone point me to a relevant IPC spec that specifies an allowable board stretch, measured between metal features on outer layers (e.g., between fiducials and component pads on the topside of a board)? I've got a non-linear stretch problem that'

Board Stretch...Is there a relevant IPC spec?

Electronics Forum | Wed Aug 22 21:22:05 EDT 2001 | davef

First place to look is IPC-6012A w A#1 "Qualification & Performance For Rigid Printed Boards". I'll look at it later to see what's there.

Nitrogen V.S Solder bridging problem

Electronics Forum | Sat Sep 01 06:09:25 EDT 2001 | opor_a

Hi guy Please help advise me the impact of using Nitrogen to solder bridging defect. I heard somebody said that using nitrogen can effect the bridging problem by higher surface tension in case inaccurate printing . Is it true? Thanks.

Pad and Stencil Design

Electronics Forum | Sat Feb 09 17:33:30 EST 2002 | George Verboven

For more info about Metal Stencil Overview. also look at: http://www.tkb-4u.com/articles/printing/metalstenciloverview/metalstenciloverview.php

Board support issues

Electronics Forum | Wed Sep 19 14:58:03 EDT 2001 | jschake

You provided excellent detail, and unfortunately I do not see anything out of the ordinary except the tooling issue. This brings us back to the original tooling related questions you had asked before. My apologies for questioning your process integ


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