Electronics Forum | Fri Feb 19 14:09:08 EST 1999 | Bob Barr
When I print a message on the forum, the rightmost part of the page is truncated and the last half dozen letters or so do not print. Is there a way to print just the message without the menus on the left side? Thanks, Bob
Electronics Forum | Sat Oct 16 23:54:43 EDT 1999 | Stu Leech
We have just completed some scientific work on the subject of component bake-out and alternative methods of getting the job done quickly. If you would like a copy, email me at sleech@ix.netcom.com Stu Leech
Electronics Forum | Fri Feb 19 03:57:48 EST 1999 | Mark Alder
Please could you suggest a recommended aperture sizes for printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated.
Electronics Forum | Tue Feb 23 16:05:46 EST 1999 | Randy Haller
| What to look for that causes tombstoning and the corective action. | 1:check reflow profile 2:reduce pad size 3:reduce deposition of paste(stencil thickness/opening of aperatures) 4:Check components for solderability Good Luck
Electronics Forum | Wed Apr 14 23:01:10 EDT 1999 | wil allen
| Hi Brent, I have heard from a Fuji related person that this function will work with the QP-3. Not sure of the machine release date yet, but you may be able to check with your regional sales person.
Electronics Forum | Mon Feb 22 13:41:37 EST 1999 | Clifford Peaslee
We've isolated the problem. But we have to shut down logon and registration until it has been corrected. We expect it to be soon. Thanks for your patience. Cliff
Electronics Forum | Wed Feb 17 16:39:05 EST 1999 | 3D
What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.
Electronics Forum | Tue Feb 16 12:04:05 EST 1999 | Wayne Bracy
Cliff Each time I attempt to edit my account, or register the company, I get a failure message.... OOPPS type message. Wayne
Electronics Forum | Mon Feb 15 14:30:00 EST 1999 | Dave Turner
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc
Electronics Forum | Mon Feb 15 14:28:09 EST 1999 | Andy Bellworthy
Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc
