Electronics Forum | Wed Nov 26 13:20:47 EST 2014 | kkay
We have a lot of large through hole caps and we run everything through a wash process. Unfortunately water makes it's way inside the sleeves that the caps are shrink wrapped in. Has anyone found a way to prevent this from happening? We are running at
Electronics Forum | Tue Jun 26 15:08:17 EDT 2018 | etmpalletguy
there is another product on the market, it is nitrile Based, 100% silicone free, but the stuff ain't cheap Mcgee! an 18x18 piece of carbon black silicone will set you back $125.00, the nitrile is x4 that and that's before the NRE. Have you consider
Electronics Forum | Wed Oct 17 02:04:39 EDT 2018 | robl
SCC3 has an operating temperature of 200C, as long as it is heat cured at 100C. https://www.electrolube.com/pdf/tds/044/DCA.pdf It's also a silicone so needs to be coated & cured away from anything you value. Otherwise there are plenty of PU's and
Electronics Forum | Mon Dec 03 15:06:36 EST 2018 | proceng1
We've been doing some testing. It seems that if you move the rail IN to achieve the correct width, the exit is maybe .125" wider than the entrance. If you move it OUT to achieve the width, the exit is .25" more narrow than the entrance. So I believ
Electronics Forum | Thu Jun 13 12:44:39 EDT 2019 | dwl
A couple of caveats; The FR4 will degrade with successive reflows and will eventually need to be replaced. Not a big deal for low volume, but something to be aware of. The bigger concern is that a sheet of .125" large enough to position your assembl
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
Electronics Forum | Fri Jun 18 10:59:37 EDT 1999 | Scott Cook
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Fri Feb 25 11:13:32 EST 2000 | Russ
This probably won't help much but I find it at least a little interesting. During some experimentation recently I accidently loaded a board into the wave upside down and it had a PLCC 68 package along with other types of components that had only bee
Electronics Forum | Mon Nov 20 04:39:19 EST 2000 | SV
Hello, I have to design a PCB for which the customer have the following temperature requirements: -55degC to +85degC operating temp. -61degC to +125degC storage temp. My question is: does the FR4 material meet this conditions? Which are the parame
Electronics Forum | Mon Oct 16 11:12:42 EDT 2000 | NLykus
CEM 1 is a laminate base board material. The other boards in the experiment were manufactured using FR4 as the base board material. What I'm leaning towards is that the glass transition temperature "Tg". What do you think? Topside temperatures in
