Electronics Forum: case (Page 15 of 247)

problem in solderability

Electronics Forum | Thu Sep 04 10:42:29 EDT 2008 | vladig

You are right. That is what process engineers are for. HOWEVER, in many cases they just can not fix a problem because it either in the part, or board or paste and so on. I used ot work for a large company in QA doing lab work for production. In many

Soldering oven

Electronics Forum | Fri Jan 30 04:10:10 EST 2009 | sachu_70

Hey Daniel, N2 gas provides an inert atmosphere which help to minimise oxidation, generally a concern across the reflow zone. Although N2 provides a more shiny solder joint, it is certainly more of a cosmetic issue and does not certify joint reliabil

UIC GSM and NiPdAu pads

Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic

We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l

Electroplate Touch up

Electronics Forum | Wed May 04 06:06:34 EDT 2011 | clampron

Good Morning, I have been working with a company that has a selective electroplate touch up system from Rapid Electroplate. They have used this for repairing gold electroplate. Scratches and in some cases, replating pads that had been contaminated w

Yamaha/Philips/Assembleon

Electronics Forum | Wed Apr 03 16:27:39 EDT 2013 | gregp

Does anyone have a master cross reference chart for Yamaha/Philips/Assembleon pick and place machines? In particular I am looking to know what the Yamaha models equivalent models are in the Philips/Assembleon line up. The other important bit of inf

AVR80 BA conformal coating

Electronics Forum | Wed Mar 04 10:59:24 EST 2015 | jpierre

Hi first DS65 version is a specific dilution for dispensing machine, in this case the typical process is following: application of the conformal coating extraction of solvent (low extraction power is better)2minutes and drying the drying can be done

IPC-A-610 interpretation of wetting angle (Chapter5)

Electronics Forum | Thu Oct 12 13:15:37 EDT 2017 | davef

It is the two conditions pictured in IPC-A-610F, Figure 5-1 C, D. In the old, simplier days, we wanted our solder connection to have: * Low wetting angle * Shiny metal Today, the metal doesn't have to be shiny and the wetting angle can be a high

SMD module moving during reflow

Electronics Forum | Tue Jun 18 23:24:05 EDT 2019 | SMTA-David

Hi, I have a SMD radio module that has castellated Pads along one edge of the module. The pick and place machine appears to place them very well but when the boards come out of the reflow oven then up to 20% of them have either rotated a few degrees

Help required selecting reflow oven

Electronics Forum | Wed Jul 10 21:56:36 EDT 2019 | SMTA-Ray

It's all about temperature versus time. The longer the over IE more zones the faster you can run. That doesn't seem to be the case for you so a 5 zone running a little slower will work. What many forget is that oven manufacturers can recommend what w

Drawing / BOM Revisions

Electronics Forum | Fri Aug 02 15:58:38 EDT 2019 | slthomas

Sorry, I guess I missed the point originally but yes, in the case of separate drawings and BOMs, the drawing wouldn't have to change unless the form or fit changed enough to justify a change. Obviously if the only BOM is the one on the drawing, the


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