Electronics Forum | Thu Sep 01 11:18:16 EDT 2005 | patrickbruneel
Steve, Let me try to give you a short answer to your question. A good book in soft soldering would talk about the excellent characteristics of leaded alloys and all the reasons why leaded alloys are very reliable. In short a good book would advice y
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv
Electronics Forum | Tue May 02 13:57:21 EDT 2006 | patrickbruneel
What you can do is perforate the board holding rim by drilling holes of 0.6mm (similar to via's). This will reduce the mass and heatsinking capacity, allow excess flux drainage and facilitate convection heat contacting the board through the holes. Th
Electronics Forum | Tue Jan 16 16:46:25 EST 2007 | realchunks
Well, I do know that different solder pastes have different lives. Sh@t, some solder pastes change characteristics from lot to lot. That's why we always restest solder pastes from different lots when doing an evaluation. Some of it has to do with
Electronics Forum | Mon Jan 22 11:50:07 EST 2007 | BWET
Can anyone recommend a material which can be used an a bare board: 1. Dispensed via a syringe 2. Mimmic the electrical characteristics of a trace 3. Be processed such that they do not reflow with the solder interconnect 4. Be processed such that the
Electronics Forum | Tue Mar 20 21:49:38 EDT 2007 | davef
Mark there is no need to YELL here. Turn it down, please. While you're waiting for other to reply, search the fine SMTnet Archives to find threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=34512 You'll find that the followi
Electronics Forum | Mon Jun 25 11:55:47 EDT 2007 | ck_the_flip
I don't think THEY (Humiseal) know how their material cures. I have a data sheet from them for 1B73, and it says 24 hours at room temperature or 30 min. @ 170�F. We use our in-line oven mainly to dry the material and make it tack-free. You would
Electronics Forum | Wed Dec 05 07:25:22 EST 2007 | realchunks
All posters here are right. My point was you have to design your board to the process. You cannot simply take any connector and change it to Pin and Paste. So much depends on your aperture openings, hole size to pin size, board thickness, number o
Electronics Forum | Fri Aug 08 02:24:04 EDT 2008 | jti
Hi, You were right on the money, the day after I posted, I recalibrated the LASER height .020 off on LA head, .01 off on LAIC, running perfect now. Secondary issue is a flicker on the monitor, the grid stays up after teaching XY coordinates, someti
Electronics Forum | Tue Nov 18 07:22:56 EST 2008 | wewilldoit
Hi folks! TI told us that we are the only one with the following problem... We discovered a really bad wetting characteristic of some SMD ICs from BurrBrown. At the moment: XTR106 / INA118 / ADS7844. After the reflow process we found out that this pa
