Electronics Forum | Tue Jul 18 09:05:54 EDT 2017 | davef
Acceptability of Electronic Assemblies IPC-A-610 F Comparison E to F versions * http://www.electronicsyorkshire.org.uk/UserFiles/PDFs/610E%20to%20F%20Redline%20comparison.pdf * https://www.youtube.com/watch?v=kD5NpsocTpw * http://www.scanditron.c
Electronics Forum | Thu Oct 12 22:36:40 EDT 2017 | stefan110882
Please ost some pictures so we can see what > you're talking about. OK here an example. I'm sorry for the bad quality - The picture is cropped and only one of two pictures that I had on the phone that I could use. According to my supervisor, th
Electronics Forum | Thu Mar 14 15:55:34 EDT 2024 | davef
Process Requirement Standard - J-STD-001 - Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable a
Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan
After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Thu Mar 03 16:41:11 EST 2005 | davef
According to an on-line posting ... SMTA On-line Presentation Comparing Industry Standard Revisions March 9: IPC-A-610 with Regards to Lead-free Technology There have been extensive and significant changes to the industry standard IPC-A-610 with th
Electronics Forum | Wed Oct 17 17:36:32 EDT 2018 | davidsmullins
Thanks for all the input! I should clarify a couple things. We are a contract manufacturer; we simply build to our customer's design prints. This particular board, we outsourced because of some requirements for processes we don't do in-house. So, we
Electronics Forum | Tue Jan 30 01:32:24 EST 2001 | PeteC
Bill, We do solderpaste reflow on through-hole here every day on plated-thru-holes. We do it on connectors only. It is a reliable process. We use no special profile. The stencil apertures must be modified for this process. Check out the IPC-7525 "St
Electronics Forum | Thu Mar 15 03:24:48 EST 2001 | Scott B
We are currently having a conflict of opinion with our QA department regarding the very few occurences we have of chip resistors being soldered upside down (i.e. the resistive element towards the board). IPC-A-610C para 12.3.2 specifies that this co
Electronics Forum | Wed Mar 21 20:40:28 EST 2001 | dblsixes
We are building a monster ... Dimensions are 10" x 7" ... 12 layers ... A Logic Assembly with a Power Supply all rolled into one ... The Power Supply is in one section of the board, the logic in the other section ... The Power Supply obviously has a
