Industry News | 2021-04-21 10:17:09.0
Seoul, South Korea – At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Industry News | 2021-04-29 16:58:08.0
At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
JUKI Visual Inspection Machine AOI/SPI RV-2-3D Inspection resolution:15μm Board size:630mm x 300mm Dimension:W1,310mm x D1,470mm x H1,530mm weight:1,000kg Product description: JUKI Visual Inspection Machine AOI/SPI RV-2-3D,Inspection resol
JUKI Visual Inspection Machine AOI/SPI RV-2-3D Inspection resolution:15μm Board size:630mm x 300mm Dimension:W1,310mm x D1,470mm x H1,530mm weight:1,000kg Product description: JUKI Visual Inspection Machine AOI/SPI RV-2-3D, Inspection resolut
Omron 3D AOI VT-S730 FOV 30.00×30.72mm max PCB:510(W)×460(D) mm Weight Approx. 800kg Dimensions 1100(W)×1470(D)×1500(H) mm INQUIRY Omron 3D AOI VT-S730 Specifications: Features features vt-s730 aoi Top View 4Mpixel/12Mpixel Camera with Te
Industry News | 2024-04-22 10:17:25.0
Apollo Seiko, a leading innovator in soldering technology, is pleased to announce its participation in the upcoming Electrical Wire Processing Technology Expo (EWPTE), taking place May 15-16, 2024 in Milwaukee, WI. The company will showcase its J-CAT LYRA Desktop Soldering Robot in Booth 406.
Industry News | 2013-02-21 07:01:08.0
AIM Solder today announced that it has been awarded a 2013 NPI Award in the category of Flux for its NC277 No-Clean Liquid Flux.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
New Equipment | Test Equipment
SAKI 2D AOI BF-10BT 2D AOI Board Size 50 x 50mm - 250 x 330mm Resolution 10μm Dimensions W x D x H 850(W) × 1405(D) × 1130(H)mm Product description: SAKI 2D AOI BF-10BT, Board Size 50 x 50mm - 250 x 330mm, Resolution 10μm, D
New Equipment | Test Equipment
SAKI 2D AOI BF-10BT Board Size 50 x 50 - 250 x 330mm Board Thickness 0.6mm - 3.2mm Dimensions 850× 1405× 1130 Weight Approx. 420kg Product description: SAKI 2D AOI BF-10BT Offline simultaneous double-sided system SAKI 2D AOI BF
