Electronics Forum | Thu Jan 09 13:18:15 EST 2020 | charliedci
We have been experiencing an issue with solder balls coming out of wave, both RoHS and 63/37, no clean process. It has been determined that a reduction in flux has all but eliminated the solder balls except for where we need to use board stiffeners a
Electronics Forum | Mon Nov 02 17:45:46 EST 1998 | ChrisK
In my experience, solder balls are normally caused by only a few things. In order of likelyhood: 1) Water based fluxes (VOC-Free)not having the water carrier completely dried from the board before going into the solder. I.E, too fast conveyor spee
Electronics Forum | Wed Jun 06 21:58:39 EDT 2012 | davef
Higher temperatures are the primary reason that there are more solder balls with selective soldering than in wave soldering. Possible causes are: * Solder mask type is the most important factor ... Solder resists becomes stickier at higher temperatur
Electronics Forum | Thu Apr 05 11:48:25 EDT 2012 | pbarton
Are you running individual point soldering on each component lead, of are you drawing lines with the solder fountain to increase the speed of the process? Could be that if you are drawing lines, coupled with the very low flux levels you say you are
Electronics Forum | Thu Oct 01 19:07:48 EDT 1998 | Paul R. Smith
Kyung Sam, Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or you
Electronics Forum | Tue Nov 27 13:36:22 EST 2001 | jmathis
Solder balls on the topside of our wave solder boards is a real issue. We have found that during the wave solder process, solder will enter through the via holes in the form of solder balls. It seems to be related to flux captured in the vias and o
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Wed Jun 24 16:45:18 EDT 1998 | Bill Schreiber
| I know this topic has probably been talked about before...But I ran into a small situation where Solder Balls were appearing in large quantities on the PCB....the Problem has been isolated and taken care of, my question is, what are some good metho
Electronics Forum | Tue Nov 19 21:38:39 EST 2019 | zack
Hello, The first thing that you need to do is to make process mapping about this incident, so you can exactly determine all factors and observable changes happened during 2 weeks of timeline difference. According to my experience, if all equipment
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
