Electronics Forum | Tue May 30 08:07:56 EDT 2000 | David Lazarus
I am a senior industrial engineering student at the University of South Florida. For my Facility Design class, my team has chosen to design a PCA plant that will make one product. We are looking for an obsolete or in-service circuit board assembly
Electronics Forum | Mon Feb 23 21:27:20 EST 1998 | fxb
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Wed May 08 21:43:12 EDT 2013 | davef
IPC-7525A - Stencil Design Guidelines
Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70
Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu
Electronics Forum | Tue Apr 24 02:56:12 EDT 2007 | chrispy1963
If the PCB you are using is a HASL pad finish and is a leaded assembly, we use homeplate pads with a 5 mil stencil. If the circuit has Enig finish and is PB-Free then we use 1:1 apertures with a 5 mil stencil Either method should provide no solde
Electronics Forum | Sun Oct 28 08:32:47 EDT 2007 | davef
With a 7 thou stencil, we'd go 1 to 1. So for a more typical 6 thou stencil, we'd bump the aperture area by 1.15, maybe 1.2. We make no distinctions between 'innies' and 'outies'. Are you talking about castellations on land grid devices [ie, BCC�, L
Electronics Forum | Thu Oct 03 18:45:56 EDT 2002 | davef
Get started with an "On-Board Forum" [blue bar an inch down from the top of the page] moderated by Jeff Schake at DEK that was a discussion focused on stencil printing issues with 0201 technology. Chris: Are you putting 0201 on flex? If so, sounds
Electronics Forum | Sat Oct 12 05:05:09 EDT 2002 | Kenture
I run 0201 on a 5 mils stencil with openting of 15X12 and did not have any issue. The major concern is the placement and CP643 did very good job. Type 3 solder pastes was used. Good luck.
Electronics Forum | Thu Nov 01 13:08:33 EST 2001 | dave231
I am just starting to get into sub 50mil pitch, but from what I can see you are correct. But I can help with solder stencil. I cut the width only half of what the pad is, but the keep the length the same. This has helped but does not fix always. Stil
Electronics Forum | Tue Jan 27 08:08:51 EST 1998 | Jon Medernach
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
