Electronics Forum: since (Page 145 of 276)

Tombstoning

Electronics Forum | Tue Oct 12 15:20:44 EDT 1999 | Jim Schultz

I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).

Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Fri Oct 08 14:01:27 EDT 1999 | C.K.

We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 70

resistor networks- leadless vs. gull wing

Electronics Forum | Fri Sep 24 11:38:32 EDT 1999 | danielm

I am in the process of picking a new resistor network for one of our new board. Since we are new to SMT i would like to get some opinions on networks. Currently we use one molded gullwing type network on our boards with no problems. Other than space

Re: resistor networks- leadless vs. gull wing

Electronics Forum | Fri Sep 24 23:33:30 EDT 1999 | Earl Moon

| I am in the process of picking a new resistor network for one of our new board. Since we are new to SMT i would like to get some opinions on networks. Currently we use one molded gullwing type network on our boards with no problems. Other than spac

Re: resistor networks- leadless vs. gull wing

Electronics Forum | Sun Sep 26 14:09:24 EDT 1999 | jgodfrey

| | I am in the process of picking a new resistor network for one of our new board. Since we are new to SMT i would like to get some opinions on networks. Currently we use one molded gullwing type network on our boards with no problems. Other than sp

Re: Component wastage

Electronics Forum | Wed Sep 22 18:23:27 EDT 1999 | Deon Nungaray

| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard

Re: Metal Inspection Templates

Electronics Forum | Tue Sep 21 12:57:01 EDT 1999 | Chris McDonald

| | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | Thank you. | | | |

Re: Metal Inspection Templates

Electronics Forum | Tue Sep 21 13:25:18 EDT 1999 | Dave F

| | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | Thank you. | | | |

Re: Metal Inspection Templates

Electronics Forum | Tue Sep 21 15:31:05 EDT 1999 | Hugh Martin

| | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | Thank you.

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Nov 09 13:12:26 EST 1999 | Dave F

Steve: Sure, but let's figure it out for you!!! ;-) Here�s some sample calculations. Your results may vary, void where prohibited, etc 20 PITCH: Pinched aperture volume: 0.010"X0.050"X0.005" = 2.5 uin^3 Zippered aperture volume: (0.015"X~0.5)


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