Electronics Forum | Wed Sep 30 12:11:56 EDT 1998 | Claudine Hanson
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Fri Oct 09 12:55:43 EDT 1998 | Joe Devaney
We have two machines and have had good luck with them, the company is Accu-Seal, 619-452-1010. Regaeds, Joe
Electronics Forum | Wed Sep 30 12:00:02 EDT 1998 | Jim Kittel
I am looking for removable covers to protect connectors from coating during conformal coat spraying operations. Anyone know of companies handling these products?
Electronics Forum | Thu Oct 01 18:20:29 EDT 1998 | Dave F
| Has anybody know of HAST standard applicable to PBGA packages? Would appreciate help. | | Thanks. Benji: BGAs are not well documented from a standards stand-point. What is HAST? Dave F
Electronics Forum | Wed Sep 30 10:54:31 EDT 1998 | Clifford Peaslee
Very unusual. It seems to work on some pages, and not on others. I will do some research to try and correct that problem. Cliff
Electronics Forum | Tue Sep 29 17:02:12 EDT 1998 | Mike Cox
| Just verifying that I can post to the main listing. | | Cliff Wow this is nice, I think the new forum is so nice it calls for a cigar (not the presidential kind) and a round of applause (clap clap clap clap). Mike
Electronics Forum | Thu Oct 01 11:48:17 EDT 1998 | Clifford Peaslee
There was a small problem when the month has changed, which would not allow you to reply to an older thread. I have fixed that problem. Thanks for your patience. Cliff
Electronics Forum | Wed Sep 30 07:41:58 EDT 1998 | Wayne Bracy
Cliff Just a great job. We are so lucky to have this available to us. Thanks to you and all your staff. Wayne Bracy
Electronics Forum | Tue Sep 29 14:47:38 EDT 1998 | Jim Conway
I am in search of a particular piece of SM "laser" repair equipment known as "Diamant". I believe the manufacturer is European. I understand the equipment is potentially an in-line system and that it costs ~$100K. If you have any information regrar
Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan
Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action
