Electronics Forum: board (Page 1447 of 1638)

Removable Feeder labels from dymo/Brother type printers????

Electronics Forum | Fri Aug 15 22:05:04 EDT 2008 | proy

I am looking for a nice way to print labels, say 1/2"x1 1.5" which I can place on a feeder or IC tube and remove easily later. I am going to set up a laptop on a cart with a small printer and write scripts for my MRP database application so the opera

Pick and Place Nozzles

Electronics Forum | Mon Aug 18 15:03:38 EDT 2008 | awegener

I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? Are custom nozzles sometimes used for custom parts or are the nozzles mostly standardized? What kind

Solder not reflowing properly

Electronics Forum | Wed Aug 27 14:19:40 EDT 2008 | grics

Have you given this information to your paste manufacturer???(Profile, Pics of defects?) The profile seems to look ok(without knowing paste info...) I think the ramprate looks a little aggressive but it could be the scaling of the profile and the i

problem in solderability

Electronics Forum | Thu Aug 28 11:15:05 EDT 2008 | omid_juve

I've been there. Soldering no lead parts in a > leaded world can be difficult. Sounds like you > are not wetting to your parts becasue you ar enot > getting hot enough. Here's the trick - you can > turn up your profile to look like a no-lead

problem in solderability

Electronics Forum | Wed Sep 03 17:43:19 EDT 2008 | vladig

No, I don't work for Suntech (me company name is different but close, it much have been misspelled:-)) and the company isn't exactly a trace lab, However, that wasn't the point why I �jumped in�. Defining a problem as �solderability� is too generic.

problem in solderability

Electronics Forum | Wed Sep 10 14:14:03 EDT 2008 | gregoryyork

Yes why did the Electroless Nickel layer split this is the ROOT cause. My guess is still that the resist was slightly miss registered over the copper and therefore poor adhesion of the Nickel ensued OR like I said originally the resist had contaminat

no clean flux + wave soldering issue

Electronics Forum | Thu Aug 28 09:30:20 EDT 2008 | patrickbruneel

Omid, No-clean fluxes need to be used right out of the can without thinning. In the past with RA and RMA fluxes you could adjust or thin them to your desired density because they had plenty of solids up to 30%. No-Clean fluxes have a lot lower solid

looking for HASL TIN thickness specification

Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster

At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera

New to SMT Equipment

Electronics Forum | Wed Sep 17 12:06:58 EDT 2008 | wrongway

Don't forget repairing the boards all the special tips for the small parts sounds like you might be placing BGA may need a special machine just for reparing that. some places think they need x-ray for inspecting BGA. type of paste that you going to

Line release of post reflow AOI and AXI

Electronics Forum | Thu Sep 18 15:26:04 EDT 2008 | ismir

Dear Hegemon, I'm very grateful for your help. There is one more thing that I'd like to discuss with you. I'd like to know if there is any "verification board" or something like that to check if you really did a good job. At the company where I wo


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