Electronics Forum | Mon Apr 06 11:53:50 EDT 2009 | ed_faranda
Here are some pictures of the part. I created a profile for this part. I've been in touch with the vendor and he seems to think the profile is too hot. I am waiting for another board from R&D so I can work on it again. If you look at the picture,
Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Wed Apr 22 11:58:16 EDT 2009 | markhoch
Quick Question! We have an assembly that we're building for a customer that will have to be soldered via a Lead-Free Wave Solder. We do not currently have a Lead-Free Wave Solder in house. Does anyone know of a company that may be able to provide thi
Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Electronics Forum | Tue Apr 28 08:51:35 EDT 2009 | davef
This is a snip from an ealier post here on SMTnet. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically
Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef
Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu
Electronics Forum | Thu Apr 30 08:33:42 EDT 2009 | kpm135
In regards to your panelized PCB it sounds like your step and repeat in you pnp program is slightly off, by 0.02mm from the sound of it. Are all of the components moving in the same direction as the fine pitched IC? I don't know what type of machin
Electronics Forum | Tue May 12 01:09:17 EDT 2009 | malmsteen
Thanks for replying Mr BoardHOuse. The product has to be RohS compliance. Surface finished is something that I am still considering and currently looking at either OSP or Immesion Silver. In short whatever combination that can produce high reliabili
Electronics Forum | Thu May 14 14:24:28 EDT 2009 | swag
We depanel most of our PCB's using a router. We design and build all of our own fixtures in-house. Our rigid boards have not been a problem and we seem to have mastered tooling designs that work well. However, we are also running thousands of pane
Electronics Forum | Wed Jul 15 12:31:20 EDT 2009 | rwyman
Depending on the end use of the PCB, edge or corner bonding may be adequate. Much easier to rework as the material is only at the perimeter of the part. We don't do underfill of any degree in-house but a few years ago we did build a limited run of
