Electronics Forum | Wed Mar 18 16:50:20 EDT 2009 | khowell
There are many users of SN100C in reflow. SN100C was originally introduced as a wave solder alloy which offered cost savings over SAC, no solder pot erosion, and high fluidity. Since it is eutectic, no plastic range, the joints have a smooth, shiny
Electronics Forum | Fri Mar 27 10:04:51 EDT 2009 | ericthered
We have been having problems with proper wetting when running mainly lead free but also leaded solder in our Ersa Hotflow 3. Solder either often looks grainy or doesn't flow over the whole pad. This is generally the case when my profile is 170 firs
Electronics Forum | Mon Mar 30 15:16:32 EDT 2009 | Peter
Hi Tom, You're right. I do find the second locating pin hardware. Now I got them both up/down when F3 is pressed. Thanks. I don't see any pin on the hardware and no edge clamp hardware either :-( , do you know any way that I can bypass these hardware
Electronics Forum | Thu Apr 02 19:54:31 EDT 2009 | davef
CK The term that you're searching for is: "Singulation" the process of die punching circuit boards with a hydraullic press. [Although the very nice people that sell "saw depanelers" call their equipment singulators. We assume they do that because e
Electronics Forum | Mon Apr 06 11:53:50 EDT 2009 | ed_faranda
Here are some pictures of the part. I created a profile for this part. I've been in touch with the vendor and he seems to think the profile is too hot. I am waiting for another board from R&D so I can work on it again. If you look at the picture,
Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Wed Apr 22 11:58:16 EDT 2009 | markhoch
Quick Question! We have an assembly that we're building for a customer that will have to be soldered via a Lead-Free Wave Solder. We do not currently have a Lead-Free Wave Solder in house. Does anyone know of a company that may be able to provide thi
Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Electronics Forum | Tue Apr 28 08:51:35 EDT 2009 | davef
This is a snip from an ealier post here on SMTnet. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically
Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef
Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu
