Electronics Forum | Sat Sep 04 06:37:46 EDT 1999 | JC Leigh
Dear all, I don't know if I'm asking at the right place here, since you all seem to be more focused on process problems then programming problems (or perhaps programming isn't a problem for you). I'm using FUJI CP642's and I've got some components
Electronics Forum | Wed Aug 18 21:18:00 EDT 1999 | Dave F
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Wed Aug 18 21:25:37 EDT 1999 | Tony Yang
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Wed Aug 04 16:55:32 EDT 1999 | Doug
| We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough t
Electronics Forum | Thu Aug 05 10:13:44 EDT 1999 | Boca
| We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough t
Electronics Forum | Tue Jul 27 14:04:38 EDT 1999 | JohnW
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Thu Jul 29 16:42:06 EDT 1999 | John Thorup
| John, | | I'll take a look and see. It should let you know if there is anything missing from the form. | | Thanks for the report, | Cliff | | | I'm having trouble posting a wanted item to the listing. I selected the listing catagory pages and t
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Tue Jul 06 12:46:27 EDT 1999 | John Thorup
| | We are looking for some subcontractors to do surface mount | | technology boards for us. Is there anything I should pay specific | | attention when I visit the subcontractor's site? | | Thank you for any advice | | | Wolfgang has a good poi
Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
