Electronics Forum | Tue Apr 01 13:01:27 EST 2003 | cnotebaert
I have NOT done 0402's yet but also have no trouble with 0603's. Did you try any thinner stencils? I don�t know this for a fact just speculating, I would think the 0402's have a smaller brd to chip gap and that you might be able to get away with a 4
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Electronics Forum | Sun Apr 20 08:27:21 EDT 2003 | davef
Your link doesn�t work. It gives an application timed out message. Pads on the board that are too large or spaced improperly for the component usually cause skewing. Tombstoning and skewing are first cousins. Look here: http://www.smtinfocus.com
Electronics Forum | Wed May 21 15:47:34 EDT 2003 | JB
We have an HSP 4796, if the feeder mechanism is the same, this may help you a bit. First make sure that the componet definition is right on the component library. Tape or Embossed. Second, the component thickness vs actual thickness. Is the pick u
Electronics Forum | Thu May 22 08:46:05 EDT 2003 | Henry Lee
Hi I uploaded the photos http://hk.photos.yahoo.com/ee02lyk of the failure samples. The chip-cut and pin-hole were found after the manufacturing process. I initially suspect the crack happened during the reflow process.However, our factory analysis d
Electronics Forum | Wed Jun 11 12:03:29 EDT 2003 | rmurtuza
I have the speed data set at 0.12S for the small caps and in addition to that I am using an overall tact time reduction of 14 to 16 seconds. If I use the default overall tact time then I have placement defects such as components being placed: 1. Twi
Electronics Forum | Wed Aug 27 14:45:08 EDT 2003 | M. Cruise
Todd covered it all. And you will have a hell of a time verifying all that. BUT he is perfectly correct. I have worked on such problems and boy are they difficult to trouble shoot. But one time the problem was found to be "the height of the machine".
Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon
Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan
Electronics Forum | Fri Jun 27 08:34:01 EDT 2003 | caldon
You should also look at the Semiconductor assembly side as well. Datacon and others are working hard to knock down the barriers between SMT and Semi. Also look at process obsolescence! Flip chip has been around for year but has not made it into main
Electronics Forum | Wed Jul 09 10:55:51 EDT 2003 | Veronica
Hi Reman01, I have done that before when I was in Motorola. What kind of ball are you trying to repair? How many pieces of BGA chip do you need to repair a day? If it is not too many, you can do it by yourself. It is a lot, such as 100 to 1000 piece
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