Electronics Forum | Fri Dec 20 09:01:27 EST 2002 | russ
Greetings, Does anybody out there have any experience with 0306 capacitors (not 0603). I am trying to find a pad design for this component. I have searched the archives to no avail. The component is .06 long by .03 wide with .007" solder terminat
Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef
Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta
Electronics Forum | Fri Jan 17 16:36:04 EST 2003 | MA/NY DDave
Hi As DaveF notes there are many sources. In one of my lives, I used to generate this business for one of the really good outfits i.e NTCu in Bethlehem, PA and I know of several more. You probably already get NTCu's mailing if you have been in the
Electronics Forum | Mon Jan 27 09:43:15 EST 2003 | davef
Sorry. I mistyped information on the guidelines. It should be: SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments Order SM-785 from: IPC 2215 Sanders Rd Northbrook, IL 60062-6135 847-509-9700 When you are ordering t
Electronics Forum | Mon May 12 23:33:48 EDT 2003 | dehlers
I purchased three On-Site units a while back to feed two reflow ovens and one wave solder machine. The cost for the lot was approx. $160,000, and flow was approx. 7500 CFH. We were quit pleased wqith the performance and the operating cost. However
Electronics Forum | Tue Feb 04 09:12:40 EST 2003 | davef
Near the top of Phil's front page is thin blue bar with white lettering that extends horizontally across the page. Click on the word "articles" on that blue bar. It will turn a rusty-brown and load another page. On that page, click on the article
Electronics Forum | Wed Feb 05 11:21:24 EST 2003 | pjc
First off, get them designed out. I had this problem once and filled them with SMD adhesive and cured prior to printing. We were careful to be sure the solder lands were clean of any adhesive prior to curing. It worked out very well and we did this p
Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch
From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques
Electronics Forum | Fri Feb 21 10:31:48 EST 2003 | adlsmt
We dont have the debridging knife. I had one on an old Hollis machine I had once. It was totally worthless. I am setting up the nitrogen today. I will let you know how its goes. We are using a water based no-clean. The nitrogen will probably make a
Electronics Forum | Tue Feb 25 15:29:46 EST 2003 | MA/NY DDave
Hi Locktite is telling you to cure first, maybe for a good reason. So the epoxy becomes stable just before solder reflow moves stuff around and around and then settles. A WEG yet if you did some cross sections and analysis you might find piles of
