Electronics Forum | Tue Feb 25 23:17:12 EST 2003 | MA/NY DDave
Hi Up above in his operation / process description after a call to Locktite and then my note and then your note, we may have found the problem. One never knows at a distance. It appears he is striving to do soldering/reflow first and then concurren
Electronics Forum | Fri Feb 21 19:41:25 EST 2003 | neil
I have had a look at what Bob Willis say's and the answer to my problem is not there. The paste we are using has a very high viscosity and I beleive that if we reduce the metal content to less than 90% it will solve the problem. The problem is parti
Electronics Forum | Wed Feb 26 16:06:34 EST 2003 | slthomas
Something else I just thought of, and MikeK touched on it briefly, is what you'll be cleaning. If you need to be capable of removing both epoxy and solder paste, for instance, you need to look at chemistry and processes that will clean both, and the
Electronics Forum | Mon Mar 03 11:12:49 EST 2003 | MA/NY DDave
Hi I have seen a few different ways to do this, including hand solder for certain PIH (pin in hole) components as the last operation. Search the archives would be one place for you to look Buy or Borrow one of the SMT Books out in the market. Ther
Electronics Forum | Tue Mar 11 10:13:15 EST 2003 | genny
Some people have said that for smaller components like 0402, a 2% silver paste (62/36/2)has helped reduce the tombstones. The reasoning is that this paste has a longer plastic zone compared to a true eutectic solder, and if there is any uneven heati
Electronics Forum | Thu Mar 27 14:38:44 EST 2003 | MA/NY DDave
Hi kenlchin, Yes, This all helps with these little components that can be affected by the forces created during soldering more so, than their own stabilizing weight. On this tread which started with a composition only proposition, we have seen tha
Electronics Forum | Sun Mar 23 13:39:39 EST 2003 | MA/NY DDave
Hi, From re reading, I think I did OK with my previous message yet I wanted to hit some other items, maybe differently. Without checking all the sources I don't believe there are any industry wide standards. I am sure and know there are industry
Electronics Forum | Fri Mar 28 09:44:11 EST 2003 | Claude_Couture
Your preheat temp seems excessive, what kind of solder paste do you use. can you try a max preheat temp of 140 degC? The reason for this is to let the solvents in the paste evaporate while keeping the activation of the flux for the very last moment b
Electronics Forum | Fri Mar 28 21:37:11 EST 2003 | MA/NY DDave
Hi Are all the other solder joints for the other components other than the MELF not having a problem. That is what you said, yet I wanted to check?? To say a less twisted way is this only with the MELFs and is it with all the MELFs?? If you have
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
