Electronics Forum | Sat May 24 00:43:59 EDT 2003 | iman
Our engineers did a study on our medical product with 1mils standoff height, and one issue was 100% of the boards that underwent ultrasonic failed due to failure of the package wirebonding. Poor reflow control would be one area to review in any event
Electronics Forum | Tue Jun 03 06:29:43 EDT 2003 | mk
Orrrrrr, you could eliminate the printing, shorting, and special surface finishes by bringing the boards in with the paste already on them. There is a process that is a much more forgiving method for applying paste called solid solder deposit. Check
Electronics Forum | Fri Jun 06 07:34:43 EDT 2003 | johnw
Rick, my understanding is that the US do not have plan's fr lead free legislation. However the European legislation states that any product entering the european market after June 2006 must meet the lead free std's of the directive. So basically if
Electronics Forum | Wed Jun 04 09:15:06 EDT 2003 | davef
We used to use 260+-5C (500+-10F) for Sn63, now we use 240-260C (460-480 F). You probably could get away with 232C (450F) in all cases, since there is no thermal mass to a lead being tinned. We keep our tinning temperature the same as our solder po
Electronics Forum | Fri Jun 06 22:10:11 EDT 2003 | MA/NY DDave
Hi John I believe gave a good answer with cautions. The .001 or .1% is the main criteria that internationally means you are Lead-free per JEITA, the EU and NEMI. They sat around at a table and decided is how they got the .1% John did note that yo
Electronics Forum | Wed Jun 11 16:55:16 EDT 2003 | MA/NY DDave
Hi Yes Thanks, I understand that there are still some arguments going on in the EU and some companies like Phillips AG, I believe, are championing changes. Even so from what I know the combined JEITA/European (Soldertec) /USA NEMI task group is sti
Electronics Forum | Wed Jun 11 17:16:12 EDT 2003 | MA/NY DDave
Hi I had to poke around awhile to see what you meant. I think you were at an advanced level where IF he knew the MSL ratings of his devices he should constrain his profile within the component mfgs tests for exposure to various profiles, or at leas
Electronics Forum | Thu Jun 19 10:18:22 EDT 2003 | Dave Milk
Hi Kevin, I hope this info is timely. To qualify a component for lead free use you need to use a lead free paste. The various lead free pastes have very different wetting capabilities and temperatures required to cause them to reflow properly. Yo
Electronics Forum | Mon Apr 12 09:10:26 EDT 2004 | davef
Levchek [ http://www.hexaconelectric.com/levchek.html ] is sold by Hexacon and most of the electronic assembly supply houses [eg, Technitool, HMC, Jensen, etc] Alternately, you can purchase heat tempered glass from your local glass store, but it wil
Electronics Forum | Wed Apr 14 21:46:42 EDT 2004 | davef
Vince Frank is probably not still here. Management at SMTnet chooses to keep all threads alive, turning a deaf ear to forum user requests to close threads after a reasonable period of time. The person that reopened this thread did so in all good c
