Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John
John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe
Electronics Forum | Tue Mar 13 11:50:21 EST 2001 | gsmguru
Here is some general things I usually ask myself when having trouble with BGA's What type of BGA ? Pitch/Bump Dia etc. Smaller bumps sizes & tighter pitches require more attention. This also impacts stencil aperature design & paste selection. Was
Electronics Forum | Fri Apr 06 09:02:20 EDT 2001 | CAL
FYI- Toe Fillets have not been required per IPC 610b/c (they are nice to have though). Remember before Solder paste inspection equipment The Solder powder type/size, stencil type, and apertures are what defined volume. The need has not been until rec
Electronics Forum | Wed Apr 11 13:32:26 EDT 2001 | slthomas
I think we've miscommunicated....I don't use that thing for measuring paste height or volume as part of the process because it's not repeatable from one operator to the next. I use it more to measure radial tape and reel parts against EIA-486, actual
Electronics Forum | Wed Apr 18 20:55:20 EDT 2001 | davef
Yins are bad, this guy's serious. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically and electrically
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Mon May 14 17:16:27 EDT 2001 | slthomas
We use both, cartridges for water soluble and jars for no clean. The only reason we do is so they can't possibly (knocking on my head) mix it up. Pros: Jar - you can put paste back into it if you want to wash your stencil, change jobs after lunch,
Electronics Forum | Tue May 29 17:04:57 EDT 2001 | hussman
No body really does these days - unless they work for someone who believes in duplicating what the vendor has already done. It used to be a good think to do in the past, cause most pastes and adhesives where kind of sensitive, but today most materia
Electronics Forum | Tue Oct 26 16:51:18 EDT 1999 | John Thorup
Hi nards I'm not quite sure what your question is. If you mean is paste volume more important than the reflow profile the answer is no. Belt speed is just a part of creating a reflow profile and all aspects I.E. pasting, placing and reflow are jus
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
