Electronics Forum | Thu Jan 08 13:47:13 EST 2004 | guest
It is my understanding that per IPC specs toe fillets are not required as they do not add any strength to a solder connection. Our thoughts were allways that proper toe fillets are a sign of a good process. What are some of your guidelines and though
Electronics Forum | Fri Jan 09 21:21:45 EST 2004 | Dave
Terry, I use a VItechnology AOI and I'm very happy with it. I find the software to be very flexible. You will realize how much components vary from one manufacturer to another, so flexibility is important. The Omron machines are good at solder
Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel
Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)
Electronics Forum | Thu Jan 15 10:08:54 EST 2004 | ADAM
Guys Does anyone have any design rules for a 121 pin BGA . The pitch is 0.031 thou, the ball diameter is 0.0115 thou . I would like to know the following : Pad and via sizes/type on the bareboard ? Stencil thickness and aperture size/sytle ? Solder
Electronics Forum | Sat Jan 17 13:25:04 EST 2004 | bob Willis
I believe this is the only system on the market place and was developed by Panasonic in Japan with Malcolm. As stated it does check a limited number of elements but that was its intention when produced. I believe that only high volume shops would u
Electronics Forum | Tue Mar 02 21:05:38 EST 2004 | Ken
Has anyone in the US used this system? I am told that over 1000 systems are operating world wide...but find it hard to believe no one domestically is using this (if it in fact is worth its salt would more not use it?) Anyone? Anyone demo'd this? A
Electronics Forum | Mon Jan 19 09:49:20 EST 2004 | davef
Not as such. Choices are: 1 Cut and epoxy some board foil from your board fabricator. 2 Sacrifice part a pad repair kits from the likes of: * Engineering Lab 905-785-1982 * Circuit Technology Center 978-374-5000 * General assembly suppliers catalog
Electronics Forum | Mon Jan 26 21:10:36 EST 2004 | Vinny
I have done acurate profiling which meets the solder paste specifications. The point I am trying to highlight here is also due to the ground plane side being much larger causing the tombstone defect. I have even tried doing a linear profile, it hel
Electronics Forum | Mon Jan 26 20:17:01 EST 2004 | davef
Some temporary solder masks outgas ammonia as they cure. It's possible that the first side cured and out gassed through the grounding hole. But when the second side cured, it outgassed between the board and the coating and in so doing reacted with
Electronics Forum | Mon Jan 26 11:10:56 EST 2004 | samaniegocesar
Hello to all of you, I'm running some small pcb's about 2.5x3.5 inches, can somebody tell me the zone temps and speed in meters/min that I have to use to get the best solder paste shine and best quality, is an oven of 8 zones. I apreciate your suppor
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