Electronics Forum | Fri Feb 11 09:48:56 EST 2000 | Christopher Lampron
Dear Masdi, Solder beading (as opposed to solder balls) is usually caused by volume of solder paste, displacement of solder paste when component is placed and sometimes the proximity of the solder depositions for that component. Basically, a small a
Electronics Forum | Fri Dec 08 23:02:24 EST 2000 | LeeKibler
Beware the foam fluxer. I had a problem with cracked caps that just about drove me off the deep end. I discovered that my foam fluxer air knife was not turned on resulting in excessive flux. The excessive flux (VOC free) was not properly dried off
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Thu Aug 10 03:30:42 EDT 2000 | JohnW
Ramon, Solder ball' are a bitch aint they?, identifying the right location to fix em is a bigger one. As you and the rest of teh guy's have said yes you'll need to look at your stenil..but maybe your stencil is good so you'll need to look else where
Electronics Forum | Fri Jun 23 14:10:01 EDT 2000 | Chrys Shea
Sounds like the mask to me. Had a similar situation a couple years ago. The mask wasn't fully cured, so it absorbed water that the preheaters couldn't dry out. When it outgassed at the wave, it caused a lot of micro turbulence that broke the surfa
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Thu Apr 26 21:09:14 EDT 2001 | davef
Hey Wolfgang: I was down at Jimbo's and tried a McEwan's Pale Ale, yech!!! And Scotch beer [eg, McEwan's Scotch Ale, Tennant's] has been so berry, berry good to me, helping to sauve the travails of winter, until I could starting working on wheat be
Electronics Forum | Mon Jun 18 15:54:25 EDT 2001 | Gil Zweig
For BGA inspection, it is my feeling that he most effective technique a facility can use is the combination of a transmission x-ray system in conjunction with an endoscope (side viewing optical microscope). In using the transmission x-ray inspection
Electronics Forum | Mon Jun 25 11:09:26 EDT 2001 | wbu
Who is this, another Dave F ? For me there�s no problem with balling and beading. I know that the boards I have with the new paste do have all what�s needed for balling and beading, just one of the oldest designs with a stencil ...., oh boy, didn�t
