Electronics Forum | Tue Sep 21 12:10:23 EDT 1999 | Mario
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Wed Sep 08 11:04:41 EDT 1999 | Timothy O'Neill
| I am using a 18 mil and below water soluble solder paste (89.5-25-80). I have never used this type of paste. The PCB has a fine pitch component of which I cannot prevent bridging. The paste coverage on the pad looks like it is slumping. It is not a
Electronics Forum | Wed Aug 25 19:44:35 EDT 1999 | Dave F
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Tue Jul 27 14:04:38 EDT 1999 | JohnW
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Mon Jul 05 18:45:01 EDT 1999 | JohnW
| Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | John, No clean is as good as your process, and the paste you are using. Everything I do is no clean and I h
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
Electronics Forum | Thu Jun 24 10:11:33 EDT 1999 | Dave F
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Thu Jun 24 16:19:46 EDT 1999 | Kennyv
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Wed Apr 07 08:38:33 EDT 1999 | Dave F
| | | I need help in finding solder paste measuring equipment. | | | | | Cuch: What aspect about paste are you trying to measure? | | | | 1 Paste qualification? | | 2 Incoming quality? | | 3 Print volume? | | | | Dave F | | | mostly looking for
Electronics Forum | Tue Feb 16 08:54:57 EST 1999 | Ross Berntson
| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the
