Electronics Forum | Fri May 15 09:09:50 EDT 1998 | Earl Moon
| We are just starting out with SMT. I need any and all the information you have. We are looking to start a small to mid range line. I provide consultation for these requirements. Please contact if interested. Sincerely, Earl Moon pod@ix.netcom.com
Electronics Forum | Mon May 04 10:50:11 EDT 1998 | Eric Jenkins
Looking to buy used or new tubes, that will fit an SOIC-16 Need these tubes ASAP. We need to bake these parts and drypack. Please email or call if you can help. Eric Jenkins 801 956-0897
Electronics Forum | Thu Apr 30 11:35:29 EDT 1998 | Ray N. Lopez Mata
Hello - I am interested in obtaining information on the possibility of integrating a Vision Inspection System with an SMT line. I am aware of systems which may be used to gather placement data and such, but are there any systems which are able to tak
Electronics Forum | Wed Apr 29 14:30:49 EDT 1998 | Rob Williams
DEAR TECHNETTER'S, When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Thu Apr 30 14:22:21 EDT 1998 | ETS, LLC
| DEAR TECHNETTER'S, | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Wed Apr 29 14:59:54 EDT 1998 | Earl Moon
| DEAR TECHNETTER'S, | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Thu Apr 30 08:55:53 EDT 1998 | Earl Moon
| | DEAR TECHNETTER'S, | | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Thu Apr 30 08:55:10 EDT 1998 | Chrys
| | DEAR TECHNETTER'S, | | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Thu Apr 30 11:28:23 EDT 1998 | Earl Moon
| | | DEAR TECHNETTER'S, | | | When profiling for the reflow process, we are given a recommended profile to use for the solder paste (no-clean). They give us a range of times to be in each zone. Ex.
Electronics Forum | Tue Apr 28 14:03:03 EDT 1998 | Achim
We want to produce BGA�s which will be see burn in conditions of 140�C / 24h active tested. Now we think about problems for the solderball uniformity. Does anybody know about problems or about special solderball alloys for such productsconditions ?
