Electronics Forum: can (Page 1488 of 2412)

Thermocouple attachment on fine pitch component.

Electronics Forum | Wed Apr 11 17:03:28 EDT 2001 | mparker

I've used Super Glue, with Kapton tape. The glue leaves a small residue and the tape acts as a strain relief. If you can sacrifice the board, drill a small hole through the board, push the exposed ends of the thermocouple up from the back side, lay

solder on gold finger

Electronics Forum | Fri Apr 13 12:37:35 EDT 2001 | edylc

>>> gold finger was covered by a Kapton tape and it was done offline away from the Screen printer or rather from the SMT lines itself, we are using an ENIG Pcb's , the process doesnt need a wave soldering ....however at the final end of the line ,

solder on gold finger

Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc

Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of

PCB Trouble shooting Lab

Electronics Forum | Tue Apr 17 03:46:34 EDT 2001 | hunter

Hello guys I need your help .....I need to know about the tools you suggest some tools for building a trouble shooting Lab. I neam is there like a complete kit having:- - Logical analyser. - LC Meter - Signal generator - V/I Characterisitc viewer.

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew

We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact

Chip Component Alignment

Electronics Forum | Mon Apr 23 07:19:23 EDT 2001 | dahsr

Can I have solder bridging two SM rectangular chip components due to misalignment? The bridging occurs at one end and is on a common trace between the two pads. The components are larger than the pad (side overhang) and are aligned rather perfectly w

Solid Solder Deposit

Electronics Forum | Mon Apr 23 09:18:15 EDT 2001 | Brandon

We are currently investigating getting a small SMT line in-house...very low quantities. I have been looking at Screen Printers and have also stumbled across Solid Solder Deposit Technology at 2 companies. I'm not sure whether we want to have the So

Solid Solder Deposit

Electronics Forum | Mon Apr 23 11:31:23 EDT 2001 | Cal

You may have answered your own question. If SSD is the end all save all there would be more people using this technology. I view SSD as an option to have flat planar pads. I also know the price per Board is more then "standard" boards. The sample b

SMT a cry for assistance!

Electronics Forum | Tue May 08 17:50:56 EDT 2001 | Philip

Barry, Process Sciences, Inc. does something called the SMT bootcamp. It is an intense two day course that takes participant through the entire SMT process. The course is taught by a senior process engineer. We are doing a course in Chicago and D

BGA CORNER WARP

Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark

BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think


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