Electronics Forum: finish (Page 150 of 229)

Stainless Steel in wash system

Electronics Forum | Wed Sep 19 11:32:17 EDT 2001 | Mike Konrad

Hi Kevin, Sorry for the delay in responding to your question. I have been trapped in Australia (not a bad place to be trapped I may add). The scale in your cleaner is not usually caused by the chemical used in the wash cycle (although Armakleen ha

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef

Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.

BGA Via Plugging

Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef

Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of

Solder Balls

Electronics Forum | Tue Apr 30 07:49:38 EDT 2002 | johnw

shawn, define what you mean by solder ball's scattered across the board? I'd tend to agree with the thoughts of too much paste on chip's but normally your ball's would be mainly around these devices although som can move around depending on the surf

Sn/Pb diffusion

Electronics Forum | Fri May 03 18:55:41 EDT 2002 | davef

Interesting situation. Everything [ie, intermetallic compounds, solderability, etc] is speculative without knowing more about the materials of: * Leads. * Solderability protection. ... because suppliers use a fairly wide of materials. Your suppl

performance improvement

Electronics Forum | Thu Jun 20 18:56:31 EDT 2002 | stepheno

If you don't already have one, the best investment you can make in your case is a good thermometer/humidity meter. They are not at all expensive. Then record the temperature and RH about 4 times a shift. After a few weeks (maybe sooner) you can se

Gold versus HASL

Electronics Forum | Fri Sep 13 09:16:36 EDT 2002 | bmulcahy

Hi dave, Only back in the forum today to see your query so here goes (1) VIA ,PTH holes -- we found that because the amount of gold being plated is generally less that the amount of HASL that holes can be physically wider. This then (pacticularly o

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 10:51:58 EST 2003 | MA/NY DDave

Hi O'Conner, I hope you also tell us what Universal-GeorgeW discusses with you. It is a little strange seeing his name on this list and his phone number. Gee I can give you his email address but won't.. Again distance engineering is tough. I woul

Throughput Calculation

Electronics Forum | Wed Jun 04 20:09:01 EDT 2003 | stefwitt

The tact time is determined by the slowest machine in the line. In your case it is 4.5 min. This is the time from the board leaving the output conveyor sensor to the next board leaving the sensor. The first machine, which finishes the job in 3 min. h

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef

We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th


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