Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef
Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of
Electronics Forum | Tue Apr 30 07:49:38 EDT 2002 | johnw
shawn, define what you mean by solder ball's scattered across the board? I'd tend to agree with the thoughts of too much paste on chip's but normally your ball's would be mainly around these devices although som can move around depending on the surf
Electronics Forum | Fri May 03 18:55:41 EDT 2002 | davef
Interesting situation. Everything [ie, intermetallic compounds, solderability, etc] is speculative without knowing more about the materials of: * Leads. * Solderability protection. ... because suppliers use a fairly wide of materials. Your suppl
Electronics Forum | Thu Jun 20 18:56:31 EDT 2002 | stepheno
If you don't already have one, the best investment you can make in your case is a good thermometer/humidity meter. They are not at all expensive. Then record the temperature and RH about 4 times a shift. After a few weeks (maybe sooner) you can se
Electronics Forum | Fri Sep 13 09:16:36 EDT 2002 | bmulcahy
Hi dave, Only back in the forum today to see your query so here goes (1) VIA ,PTH holes -- we found that because the amount of gold being plated is generally less that the amount of HASL that holes can be physically wider. This then (pacticularly o
Electronics Forum | Fri Mar 07 10:51:58 EST 2003 | MA/NY DDave
Hi O'Conner, I hope you also tell us what Universal-GeorgeW discusses with you. It is a little strange seeing his name on this list and his phone number. Gee I can give you his email address but won't.. Again distance engineering is tough. I woul
Electronics Forum | Wed Jun 04 20:09:01 EDT 2003 | stefwitt
The tact time is determined by the slowest machine in the line. In your case it is 4.5 min. This is the time from the board leaving the output conveyor sensor to the next board leaving the sensor. The first machine, which finishes the job in 3 min. h
Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef
We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th
Electronics Forum | Wed Apr 21 17:08:32 EDT 2004 | dave
Congratulations on your new customer. This could be a keeper. Here's what you're familiar with: Electroless Nickel - per MIL-C-26074 and ASTM-B733. Electroless nickel describes the plating of nickel deposits, which may contain phosphorus and boro
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
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