Electronics Forum | Wed Jan 13 07:37:45 EST 1999 | EFData
We have evaluated using WS-629 and our feelings are that the formula is not very stable. One evaluation showed great results; superior solder joint appearance and good printability. The paste would not roll on another evaluation nor would it release
Electronics Forum | Wed Jan 13 21:46:03 EST 1999 | Dave F
| I am currently using Alpha WS629. I have a Malcom SPS-1 Solder paste mixer. I find that the mixer after running for the recommended mixing time | (10 to 18 Min) ball's the solder in the jar. | | 1) Is there any other Manufacture having the same
Electronics Forum | Thu Jan 14 11:06:33 EST 1999 | Earl Moon
| | Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | | | K
Electronics Forum | Sun Jul 26 20:54:40 EDT 1998 | Masdi Muhammad
Hi, Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subjecte
Electronics Forum | Fri Jun 19 15:17:54 EDT 1998 | Chris Jackson
We are in the process of validating Silicon 1C55 (thermal cure) conformal coating over Alpha LR725 solder paste. I am looking for anyone who may be using this process, or has been exposed to someone who is doing this process. Our concern is with the
Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen
| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl
Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman
If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle
Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef
That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl
Electronics Forum | Tue Oct 16 18:42:32 EDT 2001 | mparker
I go with DaveF's advice. You are probably curing the glue too fast. Another phenomenon that I have experienced was during glue cure and solder paste reflow simultaeously. A good reason to run a glue cure profile seperately from solder paste reflow
Electronics Forum | Tue Dec 18 18:14:16 EST 2001 | mparker
Years ago the FDA banned red dye # 2 because it too was found to cause cancer in lab rats. This was a good thing because the red dye was commonly used in a lot of food products as well as cosmetics. However, one case in point was baffling. It seems
