Electronics Forum | Wed Sep 01 04:40:45 EDT 1999 | Jeff Sanchez
Great job guys, You did it again. Just when I thought the perks where gonna get more mundain and you ran out of good stuff. Now I can send a thread to a friend with out having to copy and paste. Not only that but it gives the author a little more
Electronics Forum | Wed Sep 01 08:58:17 EDT 1999 | Cunli
Jeff, Thank you for the nice comments. We at SMTnet are very glad to know you like the forwarding feature. You actually explained its importance better than we could have. We will definitely keep up the good work. Regards, Cunli | Great job
Electronics Forum | Wed Sep 01 04:07:31 EDT 1999 | Brian
| Recently, our solder dross reclaimer refused to take our | used solder paste tubes. He said the small percent of paste | remaining in the tube is now considered hazardous waste. I'm interested in advice on how others are disposing of this "hazardou
Electronics Forum | Wed Sep 01 13:58:10 EDT 1999 | Dave F
| Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective w
Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Thu Sep 02 11:47:55 EDT 1999 | ScottM
| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea
Electronics Forum | Wed Aug 25 09:53:40 EDT 1999 | lwk
| | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | Most common reason is uneven heating where
Electronics Forum | Wed Aug 25 17:09:53 EDT 1999 | Earl Moon
| | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Co
Electronics Forum | Mon Aug 23 17:49:09 EDT 1999 | John Thorup
| This is out of the normal scope of this site but� | | I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Component Ide
Electronics Forum | Tue Aug 31 09:20:22 EDT 1999 | Jon Gruett
| | This is out of the normal scope of this site but� | | | | I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Compone
