Electronics Forum | Tue Feb 03 10:44:56 EST 2009 | lmartenson
We have been having problems placing a domed LED with a Mydata HYDRA. The pocket that the part comes in seems to have some slop causing the part to be picked crooked. We have been playing around with different custom tools. Has anyone had similar
Electronics Forum | Tue Feb 03 12:39:16 EST 2009 | markhoch
Not sure what your job quantity is, or how many total parts you have to place, but we've had similar issues in the past trying to place domed LEDs. We had better luck cutting the tape into 25 or 50 piece strips and using double-sided tape to put the
Electronics Forum | Wed Feb 04 09:18:57 EST 2009 | stepheniii
You need to profile to the paste. And if a part can't take the temperatures, then you have to have something done about the parts. At one time most components had peak temperature information back when we didn't really need it becuase profiles were
Electronics Forum | Thu Feb 05 09:50:00 EST 2009 | mlimberg
Smartasp, Certain software packages used with Reflow Profilers have a tab where individual TC's can be set to a different spec. This will allow you to monitor package temps while still monitoring the solder paste specifications. You can define each
Electronics Forum | Wed Feb 04 08:39:46 EST 2009 | smartasp
Hi The issue is not the equipment or any other technical matter. The point is that the argument is about the 10 deg C higher melting point. The process window of SN/CU is somewhat smaller but manageable. I know Nihons web site but found not enough i
Electronics Forum | Wed Feb 04 05:56:31 EST 2009 | erhard
Hello Bart, we should still have what you need in our museum department. No, seriously we even still repair these units. Please send me your contact details to eh@AdoptSMT.com so we can communicate directly. Best regards, Erhard Hofmann AdoptSMT G
Electronics Forum | Wed Feb 04 06:48:34 EST 2009 | muarty
Has anyone any experience of using completely dry under stencil cleaning. I have recently been sent some information regarding Micro�Wipe� FP cleaning rolls. The claims about their performance are pretty good, but then what are they like in reality?
Electronics Forum | Wed Feb 04 08:00:30 EST 2009 | milroy
Hi, It depends on the stencil thickness, aperture size and the component footprint. For exampl if you have a PCB with QFP,CSP,QFN & BGA parts then this underwiper is not useable because you will still find solder cream deposits in the apertures aft
Electronics Forum | Wed Feb 04 09:21:09 EST 2009 | rameshr
Dear Sirs, We are looking for a quality/EHS approved vendor/make/part for safety products - gloves ,glasses for the following applications, 1.SMT Sceen printing Operator. 2.Reflow & Wave Soldering Operator. 3.PCB Cleaning. We would like to get detai
Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70
Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu
