Electronics Forum: any (Page 1519 of 1647)

Beginners' steps to run wave soldering process

Electronics Forum | Mon Feb 20 15:03:56 EST 2006 | davef

Q1- Will we be able to select the materials (flux and alloy) and run the process depending only on ourselves, distributors� help, machinery documentation, web data and �trial and error?� A1- Your materials suppliers [eg Kester, Alpha Metals, etc] wil

DEK265 or DEK260 for high mix low volume ???

Electronics Forum | Mon Feb 20 17:56:46 EST 2006 | Chris

If you are running FR4 PCBs and not something exotic like Kapton flex circuits, I would go with the Dek 265 any day of the week. You will find that Dek supports the fully automatic printer much better than the semiautomatic printers like the 260, 24

ESD Flooring

Electronics Forum | Fri Feb 24 13:19:33 EST 2006 | Chunks

Just have everyone where a smock. Seems to do little for ESD but everyone buys into it. Finger cots will add more flare as well. Wet concrete works the best for flooring, but seems to have a tendency to dry, thus losing it conductivity. Therefore

Necessity of ROSE in commercial quality processes

Electronics Forum | Mon Feb 27 13:02:13 EST 2006 | masrimhd

Hi, Thank you for your answers. But I want to explain some points on which I would appreciate any comment: * Having calibrated the process, we intend to carry out the ROSE test just on SAMPLES of the finished boards. Lets say one every hour. I exp

Question on Thermal Overstress on BGA Balls During Rework

Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier

We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th

Heat Sink for QFP

Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef

Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio

Typical SMT Machine changeover times?

Electronics Forum | Wed Mar 29 03:40:06 EST 2006 | Frank

The Juki 2060 can have both front and rear trolleys and you do not loose any feeder locations. My question was why can't the Assembleon put trolley on the rear? I recently visited a friend at a company that used a lot of Assembleon and compared run

Flux Residues In Lead Free Wave Soldeing Process

Electronics Forum | Thu Mar 30 07:44:06 EST 2006 | samir

Is your customer hands-off when it comes to what type of process materials you use on their assemblies?? In the world of Contract Manufacturing Hell, you'll have a mixed bag of customers...some, who don't care what materials you use - after all, YOU

MPM UP2000 Installation

Electronics Forum | Fri Mar 31 11:36:26 EST 2006 | fastek

Smart- The UP2000 is one of the most durable and easiest to operate fully automated printers ever to be designed. I would almost venture to say it was the best printer MPM ever made. Issues with them usually revolved around good or bad maintenance p

Question about leaded parts used in leadfree soldering process

Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir

Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent


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