Electronics Forum | Thu Apr 22 11:04:58 EDT 1999 | Boca
| | I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | | | I was thinking, as we set up our line, our money would be more well spent with control
Electronics Forum | Tue Feb 19 19:36:21 EST 2002 | davef
You weren�t clear but I assume the problem is not widely distributed and affects only a few parts on each board. Do this trick: * Cut a ~1� piece of fairly serious wire, like 18 or 12 AWG. * Strip the insulation. * Gear-up with gloves, glasses, and
Electronics Forum | Wed Feb 21 14:14:11 EST 2007 | rgduval
Hi, Bill, Lead-free solder and paste manufacturers will be a great resource for you during the transition; they've tested their products extensively, and their application groups have been able to help me through the biggest changes. There are a fe
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Fri Feb 11 18:09:11 EST 2000 | Glenn Robertson
Russ - I agree with the other guys that the problem could be black pad or some intermetallic problem, possibly related to the "conversion" to HASL finish. But my first guess is still partial reflow at wave soldering. You won't catch it by push
Electronics Forum | Wed Nov 08 11:48:09 EST 2000 | Chris May
Gary, Here goes for what it is worth. We store all of our SM reels in the SM area in proper trolleys (Mossmann-Tebbs types). They are stored by part number, which sets them into Capacitors by value and size. Resistors the same and so on with induc
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
Electronics Forum | Sat Oct 07 04:02:50 EDT 2000 | C.J. Long
Good morning, All: I am from PCB shop and one of our customer is experiencing solder bridge on 16 mil pitch QFP( immersion gold finish). Land width requirement is 8 +/- 1 mil measured over top of of land and our mean is 7 mil. Bottom land width is 8
