Electronics Forum | Mon Feb 04 20:27:25 EST 2002 | davef
1,000 G ohm ||100 M ohm Dielectric Constant ||9.5 ||4.9 Loss Factor ||5 - 20 ||200 * E indicates exponent Continuing: * Spacing between same plane traces effect the electical parameters between the traces. * Dielectric materials used between diff
Electronics Forum | Tue Apr 09 10:36:32 EDT 2002 | gregp
I assume there are a variety of people that participate in this forum, i.e. contract manufacturers, OEM's, in a variety of job functions related to the production of surface mount boards. I have read about many concerns regarding the wrong part issu
Electronics Forum | Mon Apr 22 23:51:06 EDT 2002 | mkkrishnakumar
Dear sir, I am a regular viewer of smtnet.com and now one of my customer have the process problem that is they are having double sided smd's and pth too. hence we have suggested them to do the following processes First do the smd soldering by ste
Electronics Forum | Mon Apr 29 22:41:36 EDT 2002 | davef
Refer to J-STD-33 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface-Mount Devices. You can be downloaded it free from http://www.jedec.org Assuming you want to meet expectations when selling your components to
Electronics Forum | Wed May 22 22:59:04 EDT 2002 | alex_kirichenko
Hello!!! Just to say, I've never even heard about placing parts on double-sided tape for inspection... We always build one board placing parts on paste/glue and inspect it befor reflow. With suppliers specs of 6hours at least, I don't see any prob
Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef
Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from
Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Mon Aug 19 11:13:18 EDT 2002 | ksfacinelli
I would like to understand what different options people are using to place low volume / odd form parts. I am very familiar with the tweezers / vacuum pen method however this can be less than desirable. I am looking into a manual pick and place to
Electronics Forum | Wed Aug 21 17:50:05 EDT 2002 | davef
First, it�s GREAT that your defect rate of 282 is very close to your Boss� goal of 50 ppm. Second, your Cpk and your ppm numbers don�t tie out with our expectations. You say Cpk for: * mounter is 1.0 and �your mounting is 83ppm�. * printing is 1.33
Electronics Forum | Wed Aug 21 20:11:34 EDT 2002 | mitch
We are going to begin using a 64 pin 10mm QFP with 0.5mm lead pitch. I was recently asked if we need to purchase our PCB with E3 coating instead of tinned pads when using the .5 pitch. The concept being suggested is that the E3 coating will give us b
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