Electronics Forum: tinning (Page 153 of 169)

Leadfree dip soldering

Electronics Forum | Thu May 05 03:22:38 EDT 2005 | Hannu

I do not mean big, heavy transformers but rather small ferrite core transformers, with ferrites in the range of EF16 .. EF40. The weight of the lead and its percentage of the total weight is not the issue here. We simply do not want lead-containing t

Dewetting on QFP

Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef

Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa

cap size and copper thickness vs part size questions

Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey

Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office

ABW Systems TSC1008

Electronics Forum | Sun Nov 27 11:32:30 EST 2005 | cyber_wolf

They may tell you it will solder lead free,(and it may) but trust me...you are going to have nothing but headaches. If you start flooring the heaters you are going to put it into a "melt down" after a while. I know you don't want to hear it, but tak

More Specifics Needed - USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Fri Jan 20 11:44:40 EST 2006 | Mike Dolbow Atotalgps.com

I have seen 100% Matte Tin plating and a lot of Sn/Ag/Cu plating for gull wing parts. This is the most common type of plating. Also in a lead free process you will see that the very end Toe of the part will not flow. This is due to the metal being cu

Immersion white tin wave soldering problem

Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax

What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef

There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|

SMT termination visual and solderability issues.

Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling

CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function

Beginners' steps to run wave soldering process

Electronics Forum | Thu Feb 16 13:06:49 EST 2006 | masrimhd

Hello, We�ve ordered the line machinery for our TV factory. It should be ready after two to three months. We will start producing Analog CRT TVs using single sided FR2 or CEM1, thru-hole components and tin-lead wave soldering process. Knowing that

does potato can absorbed the solder or lead

Electronics Forum | Fri Jul 14 14:05:55 EDT 2006 | nodlac

Additional to Dave F.... A potato has Iron @ 2.75mg and Magnesium @ 55mg. The leaching of these two meatls could contaminate the solder pot and taint the solder. ----------------------- Additional to my additional..THE SOLDER POT POTATO BATTERY...A p


tinning searches for Companies, Equipment, Machines, Suppliers & Information