Electronics Forum | Fri Feb 03 09:50:37 EST 2012 | mosborne1
Thanks very much everyone. > > I'll try out a > 5mil and see how that goes. If you are using 6mil stencil and you are saying that you need more on the 0603 parts then you might want to look at your squeege pressure. What kind of squeege blades ar
Electronics Forum | Mon Feb 11 09:49:43 EST 2013 | marcelorotofrance
Well, i can divide the inaccuracy in two phenomenons: Poor repeatability, i.e. the pockets don't stop at the same position after every shot by a margin of up to 0,5mm (20mils). The second problem is the stop pocket position, which is not equal from o
Electronics Forum | Mon Nov 16 05:55:29 EST 2015 | bobpan
Hello, Average correction should be used. If the nut on the z-rod is what you are seeing through the parts leads...you can use a smaller o-ring and slide it up to where the nut is to block it out. You may have to try a few sizes and/or even double ov
Electronics Forum | Fri Dec 01 12:56:33 EST 2017 | emeto
It seems that it will work with 5 mil stencil. To be safe use 4 mil if the rest of the design allows it. 10x20mil apertures for both rows. If you have bigger footprint in the corners, make bigger apertures there. For the ground plane, I would use ver
Electronics Forum | Wed Dec 20 10:44:31 EST 2017 | bobpan
The z-rod bellows on head 2 and head 3 are slightly bent. The machine will show you this error if the runout is over 6.5 mils. This is usually caused by too much z when picking parts out of a vib or tray feeder. The machine will probably run. I ha
Electronics Forum | Fri Sep 10 15:32:30 EDT 1999 | Earl Moon
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Mon Sep 13 05:02:19 EDT 1999 | Brian
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se
| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We
Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon
| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.
Electronics Forum | Mon Aug 16 16:54:57 EDT 1999 | Scott Cook
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
