Used SMT Equipment | SPI / Solder Paste Inspection
SKU 16529 • Fastest solder paste inspection (SPI) system • Excellent 3D inspection • 3D SPI system for mid- to high-volume manufacturing • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 compon
Used SMT Equipment | Pick and Place/Feeders
1.00: 35 micron for chips & 25 micron for QFP Component range - minimum: 0.4 x 0.2 mm (01005) to - maximum: 45 x 45 mm Maximum component height: 10.5 mm (0.41”) [optional: 12 mm (0.47”) ] Automatic toolbit exchan
Used SMT Equipment | Pick and Place/Feeders
Modern high performance Manncorp / Autotronik pick and place machine with 60 electronic smart feeders. The current model is the MA392v1 or BA392v1 and both have a base price of around 70,000.00. It is my understanding that this machine has all the sa
Used SMT Equipment | Pick and Place/Feeders
ASM Assembly Systems SIPLACE X4i S Placement Machine (2015) Brand: ASM Model: SIPLACE X4i S Machine Type: Placement machine Year: 2015 Serial #: G785-12041706 Machine Specifications: Configured with 4 x Siplace SpeedStar CP20P heads (37,500
Used SMT Equipment | AOI / Automated Optical Inspection
SAKY BF-PLANET-X With a superior resolution of 10μm and scanning line color CCD camera, both AOI system provide accurate and stable inspection results. Solder fillets on components as small as the high density mounted 01005(0402) chip, as well a
Used SMT Equipment | SPI / Solder Paste Inspection
TRI TR7007 3D Solder Paste Inspection Technology, SPI, Year 2011 Test Research Inc. (TRI) Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspe
Used SMT Equipment | AOI / Automated Optical Inspection
Table top - high speed AOI capable of even the highest technologies, 01005 M22XDL-460 Desktop AOI inspects SMT and PTH components (presence, type, polarity, offset, text, etc.) and reflow and wave solder joints (including meniscus). Provides 2-D so
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI HS70 3D Solder Paste Inspection Machine (2011) Brand: Parmi Model: HS70 Solder Paste Inspection Machine Serial #: H7S0 Year: 2011 Machine Specifications: Software Version: Parmi 3D SPI v1.5.1.2 Conveyor Inspection Program: Single Lane
Used SMT Equipment | Pick and Place/Feeders
PCB Size: 48mm×48mm～250mm×510mm 48mm×48mm～250mm×610mm Placement accuracy: H24G：±0.025mm(标准模式)/±0.038mm(生产优先模式) (3σ) cpk≧1.00 V12/H12
Used SMT Equipment | Pick and Place/Feeders
PCB Size: 48mm×48mm～250mm×510mm 48mm×48mm～250mm×610mm Placement accuracy: H24G：±0.025mm(标准模式)/±0.038mm(生产优先模式) (3σ) cpk≧1.00 V12/H12
