Electronics Forum | Wed Jan 07 02:08:56 EST 2009 | sachu_70
Hi! Just joined the circuit. Hot Bar soldering is very reliable provided the Flexible Printed Circuit (FPC) and Rigid PCB design support this technique. Some of the critical aspects that need to be considered include Stencil apperture design for sold
Electronics Forum | Wed Jul 13 17:02:49 EDT 2011 | doremi
Hi, I don't know if you have any AOI experience, so it is difficult to answer to your first question. Omron AOI software has a library, which is based on Jedec, so you can use just 10-15 different general models and will create hundreds of library co
Electronics Forum | Thu Dec 26 08:40:21 EST 2013 | vileo72
Hi , During one of NPI trial ,we found that boards ( CEM -1 grade )has got discolored on the masking portion ( and not on the conductors) after reflow .Although it does not impact our Form /Fit and Function characteristics , I would like to get your
Electronics Forum | Fri Jul 24 16:33:45 EDT 2015 | cnotebaert
You should be fine! best practice for a situation like this would be to run a solder sample, either flux it and run through wave, or screen print, don't place parts and run through reflow. look for proper wetting characteristics if you see de-wetting
Electronics Forum | Tue Feb 16 14:04:10 EST 2016 | tsvetan
We are designing board which have to plug in M.2 connector and thickness is limited to 0.8 mm The board is very complex with many BGAs and DDR3 memory chips and we will need 6 layers for routing. The problem is that we will need signals with 50, 90
Electronics Forum | Mon Dec 30 12:48:18 EST 2019 | rgduval
Keep in mind that the oven temperature does not, necessarily, equate to the board temperature. The thermal characteristics of the parts and copper will cause the board temperature to be different, sometimes significantly, than the oven temperature.
Electronics Forum | Thu Nov 02 04:42:48 EDT 2023 | tinaheussaff
In general, it is safer to use a single alloy with a known composition and performance characteristics. If you need to change the alloy used in your selective soldering machine bath, it is advisable to consult with the manufacturer or a soldering exp
Electronics Forum | Fri Sep 24 11:13:45 EDT 1999 | Earl Moon
| | | I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. | | | | | | I Hope than you send my information about this. | | | | | | | | Try this Link h
Electronics Forum | Wed Jul 07 18:22:25 EDT 1999 | ETS - Brian Stumm
My company, ETS, is a manufacturer of solder reflow and curing ovens. I would be happy to share some of our q/c test methods with you for verifying the uniformity and repeatability of the new ovens we manufacture. I think these tests will tell you al
Electronics Forum | Wed Jul 07 22:59:06 EDT 1999 | Dave F
| Hi! | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board uniformi
