Electronics Forum | Mon Jun 21 12:02:36 EDT 2010 | roland_grenier
check your de-panelling process if you are using break-out tabs or V scoring.
Electronics Forum | Sun Jun 27 22:25:51 EDT 2010 | leadthree
*** silly question deleted, there are no 100nF NPO ***
Electronics Forum | Wed Jun 23 08:47:32 EDT 2010 | mun4o
Hi, about location - components are in the diferent location on PCB.In the one PCB have 7 cap 560pF 0603 , and some of thenm are cracked, another are OK. When I look at 20x microscope , I can't see defect, but ICT measure from 200 to 350pf.When hea
Electronics Forum | Mon Aug 30 09:17:28 EDT 2010 | sreid
Yes we have a set Hot-Tweezers. I should have stated above that all of the resistors have been removed already and the new parts are being soldered on. I was just looking for a quicker method of rework. But thanks for the ideas.
Electronics Forum | Wed Jul 29 21:16:17 EDT 2020 | SMTA-64387706
Hi, I have a PCB that works fine when tested before conformal coating with HumiSeal 1B73. It seems like the CC is causing electrical issues. We brush it on, so it is a bit thick. After curing we are getting QFNs that do not seem to connect well and a
Electronics Forum | Mon Feb 08 17:11:34 EST 2010 | woodsmt
Thanks Dave and Glenn, I have setteled on Dye for the destuctive checks, and was thinking about impedence testing at intervals during ESS. Based on the research I have been doing the last several days, this seems like a method that should identify
Electronics Forum | Mon Jun 21 02:15:03 EDT 2010 | ppcbs
We also encountered the crack case in multi layer Ceramic Cap,0603 after touch up. Most failure were on the terminals. Previously, we used 0805 instead 0603.that time, failure were very few.
Electronics Forum | Tue Jul 06 12:06:32 EDT 2010 | baildl632
Is the board a two sided smt board? If so, where are the standoffs (board supports) located during the second side run? The 0805 being thicker than the 0603 may explain why 0805 was cracked less.
Electronics Forum | Mon Jul 12 00:23:02 EDT 2010 | leadthree
I had cracking caps from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. That put lots of mechanical stress on the PCB. So have also a close look at the ICT, or another other test fixtures you use.
Electronics Forum | Fri Aug 27 12:28:34 EDT 2010 | patrickbruneel
Under certain circumstances, Toyota says, solder connections may develop a crack that creates unpredictable behavior in the circuit. Look here: http://www.thecarconnection.com/marty-blog/1048692_toyota-recalls-1-1-mi
