Electronics Forum: heat sink (Page 16 of 27)

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Tue May 01 20:40:38 EDT 2018 | sarason

In the past I have worked on 600 Amp FET Blocks. The rule was no voids. The circuit board would be heavy copper. 4 times normal plating time. Not particularly high resolution on the board say 20 mils. To help with the heavy plating. The boards were t

BGA Reliability

Electronics Forum | Wed Jul 24 23:21:26 EDT 2002 | ppcbs

Being in the line of BGA rework and having performed much rework on boards that go into military planes, I can give you an opinion from a practical background rather than an in depth study. Basically BGA's have caused many of my customers big headac

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics

Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Re: Providing Thermal Relief On Vias/Like A Wagon Wheel??

Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F

| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints

Re: power dissipation design

Electronics Forum | Wed Apr 05 22:31:51 EDT 2000 | Dave F

Robert: Out of curiosity, by "BT" do you mean: � Bismaleimide triazine, the stuff used to increase the tg of resins used in some BGA interposers. � British Telecommunications plc, the guys with bad teeth. � BrookTree, the RAMDAC supplier, that�s par

Re: Reliability of power module soldering

Electronics Forum | Sat Feb 19 05:07:28 EST 2000 | Dean

I'm not exactly sure of your problem...but I'll give it a shot. I assume the screw is on the solder side of the board. If you wave solder the screw the head will fill in with solder. Try a water solouble mask or peelable laytex mask over the screw

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:32:05 EST 2000 | Dave F

Wow, someone read the fine SMTnet Archives!!!! Scary, get their name!!! [OK, I�ll stop ... Several points are: * Most of the stuff in the fine SMTnet Archives is all the bad things that we can make-up to respond to the questions people ask. Ther

Re: Reliability of power module soldering

Electronics Forum | Sat Feb 19 05:07:28 EST 2000 | Dean

I'm not exactly sure of your problem...but I'll give it a shot. I assume the screw is on the solder side of the board. If you wave solder the screw the head will fill in with solder. Try a water solouble mask or peelable laytex mask over the screw

Re: Double sided parts stuffing

Electronics Forum | Thu Nov 18 19:45:26 EST 1999 | Deon Nungaray

Deon Response: Hello Will, Yes, you can reflow a double sided board using 63/37 solder paste on both sides. There are some limitations as far as the mass of the components to reflow the second time. If you have doubts or are concerned that a compone


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