Electronics Forum: increase smt capacity (Page 16 of 40)

10 Methods for PCB Heat Dissipation

Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076

https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting

Re: SMT Placment Reliability

Electronics Forum | Mon May 08 01:47:56 EDT 2000 | Jack

Charles, I think the misplacement can be devided into 2 groups: 1. parts misplaced by machine 2. parts move as the X-Y table moves If you use the solder paster right, and the place force is properly setup, the second group will be definitely no exce

SMT Production Capability

Electronics Forum | Wed Jan 28 23:23:24 EST 2004 | Dean

Any University that teaches with Mydata or Contact probably isn't worth your time. And with the increases in admissions I cant see why any University worth its salt would use such "rudimentary equations". How about cancling the football and basketb

SMT Connector, Placement Issues

Electronics Forum | Tue Oct 07 03:03:06 EDT 2008 | rafacadiz

We had the same problem last year. You need verify these key points. 1- Holes are drill, NOT PUNCH. 2- Inspect 100 Boards at microscope, and verify that there is not rest of fibers in the holes. 3- Meassure the dimensions of the holes. a) virgi

ENEPIG

Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit

Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower

iPulse M4e Pick and Place Machine

Electronics Forum | Mon Oct 24 01:19:10 EDT 2005 | darby

Hi Mike, I use variations of both of these machines in a Tenryu FV-7100s and Samsung CP45/CP45Neos. Both have been very good machines - I would find it difficult to split them. I have personal dislikes of both tooling and support systems. I would ta

Re: Ball Grid Array (BGA)

Electronics Forum | Thu Sep 10 21:48:37 EDT 1998 | Dave F

| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re

SMT process Blowhole/ Pinhole

Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman

we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r

Immersion white tin wave soldering problem

Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax

What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S

Re: SMT Pick and Place

Electronics Forum | Wed Jun 10 06:36:09 EDT 1998 | RogerB

Were in similar situation last year and opted for the Mydata. Very satisfied ! | | Our company is currently looking to implement a SMT production line. What I am looking for is feedback on people's experiences with various machines. | | Here's what


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