Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas
We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Mon Jun 27 09:09:19 EDT 2005 | Bob R.
We've all been soldering Pb free parts for a couple decades. All your surface mount capacitors have probably had a Sn finish for years. Whenever one of our parts with a SnPb finish converts for Pb free we have the manufacturing site do a small buil
Electronics Forum | Mon Feb 20 13:29:44 EST 2006 | patrickbruneel
Great work Amol, Please keep us posted about the results of the x sectioning. I personally don't believe that the cracks are due to non-eutectic properties of SAC. Because the alloy is only 4�C off eutectic and when a solder joint exits the solder
Electronics Forum | Mon Apr 17 18:29:03 EDT 2006 | lit
There is learning on all brands requiring fine tuning the test parameters. The first point is not to allow defects to escape. Many brands can do a good job with preventing escapes. The struggle with all the brands becomes false calls. The companies r
Electronics Forum | Sun Feb 24 19:10:17 EST 2008 | larryd
Skill and experiance level of assemblers is critical. High skill and experiance with the type of assembly, print and BOM and hgihlighters. Day labor would be 5 to 10 components for each assembler, already prepped with pictures or drawings showing wh
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter
> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.
Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon
| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h
Electronics Forum | Fri Mar 12 20:19:46 EST 1999 | Dean
| AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards ar
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